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advance information t his document contains information on a product under development at advanced micro devices. the information i s intended to help you evaluate this product. amd reserves the right to change or discontinue work on this proposed p roduct without notice. publication# 25769 rev: b amendment/ 0 issue date: july 31, 2002 refer to amd?s website (www.amd.com) for the latest information. am29dl320g 32 megabit (4 m x 8-bit/2 m x 16-bit) cmos 3.0 volt-only, simultaneous operation flash memory distinctive characteristics architectural advantages simultaneous read/write operations ? data can be continuously read from one bank while executing erase/program functions in another bank ? zero latency between read and write operations flexible bank tm architecture ? read may occur in any of the three banks not being written or erased. ? four banks may be grouped by customer to achieve desired bank divisions. 256-byte secsi ? (secured silicon) sector ? factory locked and identifiable: 16 bytes available for secure, random factory electronic serial number; verifiable as factory locked through autoselect function. expressflash option allows entire sector to be available for factory-secured data ? customer lockable: one time programmable. once locked, data cannot be changed. zero power operation ? sophisticated power management circuits reduce power consumed during inactive periods to nearly zero package options ? 63-ball fbga ? 48-ball fbga ? 48-pin tsop ? 64-ball fortified bga top or bottom boot blocks manufactured on 0.17 m process technology compatible with jedec standards ? pinout and software compatible with single-power-supply flash standard performance characteristics high performance ? access time as fast 70 ns ? program time: 4 s/word typical utilizing accelerate function ultra low power consumption (typical values) ? 2 ma active read current at 1 mhz ? 10 ma active read current at 5 mhz ? 200 na in standby or automatic sleep mode minimum 1 million write cycles guaranteed per sector 20 year data retention at 125c ? reliable operation for the life of the system software features data management software (dms) ? amd-supplied software manages data programming, enabling eeprom emulation ? eases historical sector erase flash limitations supports common flash memory interface (cfi) erase suspend/erase resume ? suspends erase operations to allow reading from other sectors in the same bank data# polling and toggle bits ? provides a software method of detecting the status of program or erase cycles unlock bypass program command ? reduces overall programming time when issuing multiple program command sequences hardware features any combination of sectors can be erased ready/busy# output (ry/by#) ? hardware method for detecting program or erase cycle completion hardware reset pin (reset#) ? hardware method of resetting the internal state machine to the read mode wp#/acc input pin ? write protect (wp#) function allows protection of two outermost boot sectors, regardless of sector protect status ? acceleration (acc) function accelerates program timing sector protection ? hardware method of locking a sector, either in-system or using programming equipment, to prevent any program or erase operation within that sector ? temporary sector unprotect allows changing data in protected sectors in-system
2am29dl320g july 31, 2002 advance information general description the am29dl320g is a 32 megabit, 3.0 volt-only flash memory device, organized as 2,097,152 words of 16 bits each or 4,194,304 bytes of 8 bits each. word mode data appears on dq15?dq0; byte mode data appears on dq7?dq0. the device is designed to be programmed in-system with the standard 3.0 volt v cc supply, and can also be programmed in standard eprom programmers. the device is available with an access time of 70, 90, or 120 ns. the devices are offered in 48-pin tsop, 48-ball or 63-ball fbga packages, and 64-ball forti- fied bga. standard control pins?chip enable (ce#), write enable (we#), and output enable (oe#)?control normal read and write operations, and avoid bus con- tention issues. the device requires only a single 3.0 volt power sup- ply for both read and write functions. internally gener- ated and regulated voltages are provided for the program and erase operations. simultaneous read/write operations with zero latency the simultaneous read/write architecture provides simultaneous operation by dividing the memory space into four banks, two 4 mb banks with small and large sectors, and two 12 mb banks of large sectors. sector addresses are fixed, system software can be used to form user-defined bank groups. during an erase/program operation, any of the three non-busy banks may be read from. note that only two banks can operate simultaneously. the device allows a host system to program or erase in one bank, then immediately and simultaneously read from the other bank, with zero latency. this releases the system from waiting for the completion of program or erase operations. the am29dl320g can be organized as either a top or bottom boot sector configuration. am29dl320g features the secsi tm (secured silicon) sector is an 256 byte extra sector capable of being permanently locked by amd or customers. the secsi indicator bit (dq7) is permanently set to a 1 if the part is factory locked , and set to a 0 if customer lockable . this way, cus- tomer lockable parts can never be used to replace a factory locked part. note that some previous amd 32 mbit am29dl32x devices had a larger secsi sector. factory locked parts provide several options. the secsi sector may store a secure, random 16 byte esn (electronic serial number), customer code (pro- grammed through amd?s expressflash service), or both. dms (data management software) allows systems to remove eeprom devices. by simplifying system software: dms performs all functions necessary to modify data in file structures, instead of using sin- gle-byte modifications. to write or update a particular piece of data (a phone number or configuration data, for example), the user only needs to state which piece of data is to be updated, and where the updated data is located in the system. this is an advantage com- pared to systems where user-written software must keep track of the old data location, status, logical to physical translation of the data onto the flash memory device (or memory devices), and more. using dms, user-written software does not need to interface with the flash memory directly. instead, the user's software accesses the flash memory by calling one of only six functions. amd provides this software to simplify sys- tem design and software integration efforts. the device offers complete compatibility with the jedec single-power-supply flash command set standard . commands are written to the command register using standard microprocessor write timings. reading data out of the device is similar to reading from other flash or eprom devices. the host system can detect whether a program or erase operation is complete by using the device sta- tus bits: ry/by# pin, dq7 (data# polling) and dq6/dq2 (toggle bits). after a program or erase cycle has been completed, the device automatically returns to the read mode. the sector erase architecture allows memory sec- tors to be erased and reprogrammed without affecting the data contents of other sectors. the device is fully erased when shipped from the factory. hardware data protection measures include a low v cc detector that automatically inhibits write opera- tions during power transitions. the hardware sector protection feature disables both program and erase operations in any combination of the sectors of mem- ory. this can be achieved in-system or via program- ming equipment. the device offers two power-saving features. when addresses have been stable for a specified amount of time, the device enters the automatic sleep mode . the system can also place the device into the standby mode . power consumption is greatly re- duced in both modes. bank megabits sector sizes bank 1 4 mb eight 8 kbyte/4 kword, seven 64 kbyte/32 kword bank 2 12 mb twenty-four 64 kbyte/32 kword bank 3 12 mb twenty-four 64 kbyte/32 kword bank 4 4 mb eight 64 kbyte/32 kword
july 31, 2002 am29dl320g 3 advance information table of contents product selector guide . . . . . . . . . . . . . . . . . . . . . 4 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 connection diagrams . . . . . . . . . . . . . . . . . . . . . . . 5 special package handling instructions .......................................... 6 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 logic symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 ordering information . . . . . . . . . . . . . . . . . . . . . . . 8 device bus operations . . . . . . . . . . . . . . . . . . . . . . 9 table 1. device bus operations .............................................................9 word/byte configuration ................................................................ 9 requirements for reading array data ........................................... 9 writing commands/command sequences .................................. 10 accelerated program operation ...................................................10 autoselect functions .................................................................... 10 simultaneous read/write operations with zero latency ......................................................................... 10 standby mode .............................................................................. 10 automatic sleep mode ................................................................. 10 reset#: hardware reset pin .....................................................11 output disable mode ................................................................... 11 table 2. top boot sector addresses ...................................................12 table 3. top boot secsi tm sector addresses ..................................... 13 table 4. bottom boot sector addresses ...............................................14 table 5. bottom boot secsi tm sector addresses ................................ 15 autoselect mode .......................................................................... 16 table 6. autoselect codes, (high voltage method) .............................16 sector/sector block protection and unprotection ........................ 17 table 7. top boot sector/sector block addresses for protection/unprotection ...................................................................17 table 8. bottom boot sector/sector block addresses for protection/unprotection ...................................................................17 write protect (wp#) ..................................................................... 18 temporary sector unprotect ........................................................ 18 figure 1. temporary sector unprotect operation................................. 18 figure 2. in-system sector protection/ sector unprotection algorithms ............................................................ 19 secsi tm (secured silicon) sector flash memory region .................................................................. 20 factory locked: secsi sector programmed and protected at the factory ......................................................................................... 20 customer lockable: secsi sector not programmed or protected at the factory ...................................................................................20 hardware data protection ............................................................ 20 low vcc write inhibit .................................................................. 21 write pulse ?glitch? protection .....................................................21 logical inhibit ...............................................................................21 power-up write inhibit ................................................................. 21 common flash memory interface (cfi) . . . . . . . 21 table 9. cfi query identification string ................................................ 21 table 10. system interface string......................................................... 22 table 11. device geometry definition .................................................. 22 table 12. primary vendor-specific extended query ............................ 23 command definitions . . . . . . . . . . . . . . . . . . . . . . 23 reading array data ...................................................................... 23 reset command .......................................................................... 24 autoselect command sequence ..................................................24 enter secsi tm sector/exit secsi sector command sequence ................................................................... 24 byte/word program command sequence ................................... 24 unlock bypass command sequence ........................................... 25 figure 3. program operation ................................................................ 25 chip erase command sequence ................................................. 25 sector erase command sequence .............................................. 26 erase suspend/erase resume commands ................................ 26 figure 4. erase operation .................................................................... 27 table 13. command definitions ........................................................... 28 write operation status . . . . . . . . . . . . . . . . . . . . 29 dq7: data# polling ...................................................................... 29 figure 5. data# polling algorithm ......................................................... 29 ry/by#: ready/busy# ................................................................. 30 dq6: toggle bit i .......................................................................... 30 figure 6. toggle bit algorithm .............................................................. 30 dq2: toggle bit ii ......................................................................... 31 reading toggle bits dq6/dq2 .................................................... 31 dq5: exceeded timing limits ...................................................... 31 dq3: sector erase timer ............................................................. 31 table 14. write operation status ......................................................... 32 absolute maximum ratings . . . . . . . . . . . . . . . . 33 figure 7. maximum negative overshoot waveform ............................. 33 figure 8. maximum positive overshoot waveform .............................. 33 dc characteristics . . . . . . . . . . . . . . . . . . . . . . . . 34 figure 9. i cc1 current vs. time (showing active and automatic sleep currents).................................................................... 35 figure 10. typical i cc1 vs. frequency................................................... 35 test conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 36 figure 11. test setup .......................................................................... 36 figure 12. input waveforms and measurement levels ........................ 36 ac characteristics . . . . . . . . . . . . . . . . . . . . . . . . 37 figure 13. read operation timings...................................................... 37 figure 14. reset timings...................................................................... 38 word/byte configuration (byte#) ............................................... 39 figure 15. byte# timings for read operations .................................. 39 figure 16. byte# timings for write operations .................................. 39 erase and program operations ................................................... 40 figure 17. program operation timings ................................................ 41 figure 18. accelerated program timing diagram ................................ 41 figure 19. chip/sector erase operation timings ................................. 42 figure 20. back-to-back read/write cycle timings ............................. 43 figure 21. data# polling timings (during embedded algorithms) ....... 43 figure 22. toggle bit timings (during embedded algorithms) ............ 44 figure 23. dq2 vs. dq6 ....................................................................... 44 temporary sector unprotect ........................................................ 45 figure 24. temporary sector unprotect timing diagram ..................... 45 figure 25. sector/sector block protect and unprotect timing diagram 46 alternate ce# controlled erase and program operations ........... 47 figure 26. alternate ce# controlled write (erase/program) operation timings ................................................................................ 48 erase and programming performance . . . . . . . 49 latchup characteristics . . . . . . . . . . . . . . . . . . . . 49 tsop and so pin capacitance . . . . . . . . . . . . . . 49 data retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 physical dimensions . . . . . . . . . . . . . . . . . . . . . . 50 fbd063?63-ball fine-pitch ball grid array (fbga) 8 x 14 mm . 50 fbd048?fine-pitch ball grid array, 6 x 12 mm ......................... 51 ts 048?thin small outline package .......................................... 52 revision summary . . . . . . . . . . . . . . . . . . . . . . . . 54 revision a (december 6, 2001) ................................................... 54
4am29dl320g july 31, 2002 advance information product selector guide block diagram part number am29dl320g speed rating standard voltage range: v cc = 2.7?3.6 v 70 90 120 max access time (ns) 70 90 120 ce# access (ns) 70 90 120 oe# access (ns) 30 40 50 v cc v ss bank 1 address bank 2 address a20?a0 reset# we# ce# byte# dq15?dq0 wp#/acc state control & command register ry/by# bank 1 x-decoder oe# byte# dq15?dq0 status control a20?a0 a20?a0 a20?a0 a20?a0 dq15?dq0 dq15?dq0 dq15?dq0 dq15?dq0 mux mux mux bank 2 x-decoder y-gate bank 3 x-decoder bank 4 x-decoder y-gate bank 3 address bank 4 address
july 31, 2002 am29dl320g 5 advance information connection diagrams 1 16 2 3 4 5 6 7 8 17 18 19 20 21 22 23 24 9 10 11 12 13 14 15 48 33 47 46 45 44 43 42 41 40 39 38 37 36 35 34 25 32 31 30 29 28 27 26 a15 a18 a14 a13 a12 a11 a10 a9 a8 a19 a20 we# reset# nc wp#/acc ry/by# a1 a17 a7 a6 a5 a4 a3 a2 a16 dq2 byte# v ss dq15/a-1 dq7 dq14 dq6 dq13 dq9 dq1 dq8 dq0 oe# v ss ce# a0 dq5 dq12 dq4 v cc dq11 dq3 dq10 48-pin standard tsop c2 d2 e2 f2 g2 h2 j2 k2 c3 d3 e3 f3 g3 h3 j3 k3 c4 d4 e4 f4 g4 h4 j4 k4 c5 d5 e5 f5 g5 h5 j5 k5 c6 d6 e6 f6 g6 h6 j6 k6 c7 d7 a7 b7 a8 b8 a1 b1 a2 e7 f7 g7 h7 j7 k7 l7 l8 m7 m8 l1 l2 m1 m2 nc* nc* nc* nc* nc* nc* nc* nc* nc* nc* nc* nc nc nc nc dq15/a-1 v ss byte# a16 a15 a14 a12 a13 dq13 dq6 dq14 dq7 a11 a10 a8 a9 v cc dq4 dq12 dq5 a19 nc reset# we# dq11 dq3 dq10 dq2 a20 a18 wp#/acc ry/by# dq9 dq1 dq8 dq0 a5 a6 a17 a7 oe# v ss ce# a0 a1 a2 a4 a3 * balls are shorted together via the substrate but not connected to the die. 63-ball fine-pitch bga (8 x 14 mm) top view, balls facing down
6am29dl320g july 31, 2002 advance information connection diagrams special package handling instructions special handling is required for flash memory products in molded packages (tsop, bga, ssop, plcc, pdip). the package and/or data integrity may be compromised if the pa ckage body is exposed to temperatures above 150 c for prolonged periods of time. c2 d2 e2 f2 g2 h2 j2 k2 c3 d3 e3 f3 g3 h3 j3 k3 c4 d4 e4 f4 g4 h4 j4 k4 c5 d5 e5 f5 g5 h5 j5 k5 c6 d6 e6 f6 g6 h6 j6 k6 c7 d7 e7 f7 g7 h7 j7 k7 dq15/a-1 v ss byte# a16 a15 a14 a12 a13 dq13 dq6 dq14 dq7 a11 a10 a8 a9 v cc dq4 dq12 dq5 a19 nc reset# we# dq11 dq3 dq10 dq2 a20 a18 wp#/acc ry/by# dq9 dq1 dq8 dq0 a5 a6 a17 a7 oe# v ss ce# a0 a1 a2 a4 a3 48-ball fine-pitch bga (6 x 12 mm) top view, balls facing down b3 c3 d3 e3 f3 g3 h3 b4 c4 d4 e4 f4 g4 h4 b5 c5 d5 e5 f5 g5 h5 b6 c6 d6 e6 f6 g6 h6 b7 c7 d7 e7 f7 g7 h7 b8 c8 d8 e8 f8 g8 h8 rfu rfu rfu v ss v io rfu rfu v ss dq15 byte# a16 a15 a14 a12 dq6 dq13 dq14 dq7 a11 a10 a8 dq4 v cc dq12 dq5 a19 a21 reset# dq3 dq11 dq10 dq2 a20 a18 wp#/acc dq1 dq9 dq8 dq0 a5 a6 a17 a3 a4 a5 a6 a7 a8 rfu a13 a9 we# ry/by# a7 b2 c2 d2 e2 f2 g2 h2 v ss oe# ce# a0 a1 a2 a4 a2 a3 b1 c1 d1 e1 f1 g1 h1 rfu rfu v io rfu rfu rfu rfu a1 rfu 64-ball fortified bga (11 x 13 mm) top view, balls facing down
july 31, 2002 am29dl320g 7 advance information pin description a20?a0 = 21 addresses dq14?dq0 = 15 data inputs/outputs dq15/a-1 = dq15 (data input/output, word mode), a-1 (lsb address input, byte mode) ce# = chip enable oe# = output enable we# = write enable wp#/acc = hardware write protect/ acceleration pin reset# = hardware reset pin, active low byte# = selects 8-bit or 16-bit mode ry/by# = ready/busy output v cc = 3.0 volt-only single power supply (see product selector guide for speed options and voltage supply toler- ances) v ss = device ground nc = pin not connected internally logic symbol 21 16 or 8 dq15?dq0 (a-1) a20?a0 ce# oe# we# reset# byte# ry/by# wp#/acc
8am29dl320g july 31, 2002 advance information ordering information standard products amd standard products are available in several packages and o perating ranges. the order numb er (valid combination) is formed by a combination of the following: valid combinations valid combinations list configurations planned to be supported in volume for this device. consult the local amd sales office to con- firm availability of specific valid combinations and to check on newly released combinations. am29dl320g t 70 e i optional processing blank = standard processing n = 16-byte esn devices (contact an amd representative for more information) temperature range i = industrial (?40 c to +85 c) e = extended (?55 c to +125 c) package type e = 48-pin thin small outline package (tsop) standard pinout (ts 048) wd = 63-ball fine-pitch ball grid array (fbga) 0.80 mm pitch, 8 x 14 mm package (fbd063) wm = 48-ball fine-pitch ball grid array (fbga) 0.80 mm pitch, 6 x 12 mm package (fbd048) pc = 64-ball fortified-pitch ball grid array ( f bga) 1.00 mm pitch, 11 x 13 mm package (laa064) speed option see product selector guide and valid combinations boot code sector architecture t = top boot sectors b = bottom boot sectors device number/description am29dl320g 32 megabit (4 m x 8-bit/2 m x 16-bit) cmos flash memory 3.0 volt-only read, program, and erase valid combinations for tsop packages am29dl320gt70, am29dl320gb70 ei, ein, ee, een am29dl320gt90, am29dl320gb90 am29dl320gt120, am29dl320gb120 valid combinations for fbga packages order number package marking am29dl320gt70, am29dl320gb70 wdi, wdin d320gt70v, d320gb70v i am29dl320gt90, am29dl320gb90 d320gt90v, d320gb90v am29dl320gt120, am29dl320gb120 d320gt12v, d320gb12v am29dl320gt70, am29dl320gb70 wmi, wmin d320gt70u, d320gb70u i am29dl320gt90, am29dl320gb90 d320gt90u, d320gb90u am29dl320gt120, am29dl320gb120 d320gt12u, d320gb12u valid combinations for fortified bga packages order number package marking am29dl320gt70, am29dl320gb70 pci d320gt70p, d320gb70p i am29dl320gt90, am29dl320gb90 d320gt90p, d320gb90p am29dl320gt120, am29dl320gb120 d320gt12p, d320gb12p
july 31, 2002 am29dl320g 9 advance information device bus operations this section describes the requirements and use of the device bus operations, which are initiated through the internal command register. the command register itself does not occupy any addressable memory loca- tion. the register is a latch used to store the com- mands, along with the address and data information needed to execute the command. the contents of the register serve as inputs to the internal state machine. the state machine outputs dictate the function of the device. table 1 lists the device bus operations, the in- puts and control levels they require, and the resulting output. the following subsections describe each of these operations in further detail. table 1. device bus operations legend: l = logic low = v il , h = logic high = v ih , v id = 8.5?12.5 v, v hh = 9.0 0.5 v, x = don?t care, sa = sector address, a in = address in, d in = data in, d out = data out notes: 1. addresses are a20:a0 in word mode (byte# = v ih ), a20:a-1 in byte mode (byte# = v il ). 2. the sector protect and sector unprotect functions may also be implemented via programming equipment. see the ?sector/sector block protection and unprotection? section. 3. if wp#/acc = v il , the two outermost boot sectors remain protected. if wp#/acc = v ih , the two outermost boot sector protection depends on whether they were last protected or unprotected using the method described in ?sector/sector block protection and unprotection?. if wp#/acc = v hh , all sectors will be unprotected. word/byte configuration the byte# pin controls whether the device data i/o pins operate in the byte or word configuration. if the byte# pin is set at logic ?1?, the device is in word con- figuration, dq15?dq0 are active and controlled by ce# and oe#. if the byte# pin is set at logic ?0?, the device is in byte configuration, and only data i/o pins dq7?dq0 are active and controlled by ce# and oe#. the data i/o pins dq8?dq14 are tri-stated, and the dq15 pin is used as an input for the lsb (a-1) address function. requirements for re ading array data to read array data from the outputs, the system must drive the ce# and oe# pins to v il . ce# is the power control and selects the device. oe# is the output con- trol and gates array data to the output pins. we# should remain at v ih . the byte# pin determines whether the device outputs array data in words or bytes. the internal state machine is set for reading array data upon device power-up, or after a hardware reset. this ensures that no spurious alteration of the memory content occurs during the power transition. no com- mand is necessary in this mode to obtain array data. standard microprocessor read cycles that assert valid operation ce# oe# we# reset# wp#/acc addresses (note 2) dq15?dq8 dq7? dq0 byte# = v ih byte# = v il read l l h h l/h a in d out dq8?dq14 = high-z, dq15 = a-1 d out write l h l h (note 3) a in d in d in standby v cc 0.3 v xx v cc 0.3 v h x high-z high-z high-z output disable l h h h l/h x high-z high-z high-z reset x x x l l/h x high-z high-z high-z sector protect (note 2) l h l v id l/h sa, a6 = l, a1 = h, a0 = l xxd in sector unprotect (note 2) l h l v id (note 3) sa, a6 = h, a1 = h, a0 = l xxd in temporary sector unprotect xxx v id (note 3) a in d in high-z d in
10 am29dl320g july 31, 2002 advance information addresses on the device address inputs produce valid data on the device data outputs. each bank remains enabled for read access until the command register contents are altered. see ?requirements for reading array data? for more information. refer to the ac read-only operations table for timing specifications and to figure 13 for the timing diagram. i cc1 in the dc characteristics table represents the active curr ent specification for reading array data. writing commands/command sequences to write a command or command sequence (which in- cludes programming data to the device and erasing sectors of memory), the system must drive we# and ce# to v il , and oe# to v ih . for program operations, the byte# pin determines whether the device accepts program data in bytes or words. refer to ?word/byte configuration? for more in- formation. the device features an unlock bypass mode to facil- itate faster programming. once a bank enters the un- lock bypass mode, only two write cycles are required to program a word or byte, instead of four. the ?word/byte configuration? section has details on pro- gramming data to the device using both standard and unlock bypass command sequences. an erase operation can erase one sector, multiple sec- tors, or the entire device. table 2 indicates the address space that each sector occupies. the device address space is divided into two banks: bank 1 contains the boot/parameter sectors, and bank 2 contains the larger, code sectors of uniform size. a ?bank address? is the address bits required to uniquely select a bank. similarly, a ?sector address? is the address bits re- quired to uniquely select a sector. i cc2 in the dc characteristics table represents the ac- tive current specification for the write mode. the ac characteristics section contains timing specification tables and timing diagrams for write operations. accelerated program operation the device offers accelerated program operations through the acc function. this is one of two functions provided by the wp#/acc pin. this function is prima- rily intended to allow faster manufacturing throughput at the factory. if the system asserts v hh on this pin, the device auto- matically enters the aforementioned unlock bypass mode, temporarily unprotects any protected sectors, and uses the higher voltage on the pin to reduce the time required for program operations. the system would use a two-cycle program command sequence as required by the unlock bypass mode. removing v hh from the wp#/acc pin returns the device to nor- mal operation. note that the wp#/acc pin must not be at v hh for operations other than accelerated pro- gramming, or device damage may result. in addition, the wp#/acc pin must not be left floating or uncon- nected; inconsistent behavior of the device may result. autoselect functions if the system writes the autoselect command se- quence, the device enters the autoselect mode. the system can then read autoselect codes from the inter- nal register (which is separate from the memory array) on dq7?dq0. standard read cycle timings apply in this mode. refer to the autoselect mode and autose- lect command sequence sections for more informa- tion. simultaneous read/write operations with zero latency this device is capable of reading data from one bank of memory while programming or erasing in the other bank of memory. an erase operation may also be sus- pended to read from or program to another location within the same bank (except the sector being erased). figure 20 shows how read and write cycles may be initiated for simultaneous operation with zero latency. i cc6 and i cc7 in the dc characteristics table represent the current specifications for read-while-pro- gram and read-while-erase, respectively. standby mode when the system is not reading or writing to the de- vice, it can place the device in the standby mode. in this mode, current consumption is greatly reduced, and the outputs are placed in the high impedance state, independent of the oe# input. the device enters the cmos standby mode when the ce# and reset# pins are both held at v cc 0.3 v. (note that this is a more restricted voltage range than v ih .) if ce# and reset# are held at v ih , but not within v cc 0.3 v, the device will be in the standby mode, but the standby current will be greater. the device re- quires standard access time (t ce ) for read access when the device is in either of these standby modes, before it is ready to read data. if the device is deselected during erasure or program- ming, the device draws active current until the operation is completed. i cc3 in the dc characteristics table represents the standby current specification. automatic sleep mode the automatic sleep mode minimizes flash device en- ergy consumption. the device automatically enables this mode when addresses remain stable for t acc + 30 ns. the automatic sleep mode is independent of the ce#, we#, and oe# control signals. standard ad-
july 31, 2002 am29dl320g 11 advance information dress access timings provide new data when ad- dresses are changed. while in sleep mode, output data is latched and always available to the system. i cc5 in the dc characteristics table represents the automatic sleep mode current specification. reset#: hardware reset pin the reset# pin provides a hardware method of re- setting the device to reading array data. when the re- set# pin is driven low for at least a period of t rp , the device immediately term inates any operation in progress, tristates all output pins, and ignores all read/write commands for the duration of the reset# pulse. the device also resets the internal state ma- chine to reading array data. the operation that was in- terrupted should be reinitiated once the device is ready to accept another command sequence, to en- sure data integrity. current is reduced for the duration of the reset# pulse. when reset# is held at v ss 0.3 v, the device draws cmos standby current (i cc4 ). if reset# is held at v il but not within v ss 0.3 v, the standby current will be greater. the reset# pin may be tied to the system reset cir- cuitry. a system reset would thus also reset the flash memory, enabling the system to read the boot-up firm- ware from the flash memory. if reset# is asserted dur ing a program or erase op- eration, the ry/by# pin remains a ?0? (busy) until the internal reset operation is complete, which requires a time of t ready (during embedded algorithms). the system can thus monitor ry/by# to determine whether the reset operation is complete. if reset# is asserted when a program or erase operation is not ex- ecuting (ry/by# pin is ?1?), the reset operation is com- pleted within a time of t ready (not during embedded algorithms). the system can read data t rh after the reset# pin returns to v ih . i cc4 in the dc characteristics table represents the reset current. also refer to ac characteristics tables for reset# timing parameters and to figure 14 for the timing diagram. output disable mode when the oe# input is at v ih , output from the device is disabled. the output pins are placed in the high impedance state.
12 am29dl320g july 31, 2002 advance information table 2. top boot sector addresses sector sector address a20?a12 sector size (kbytes/kwords) (x8) address range (x16) address range bank 4 sa0 000000xxx 64/32 000000h?00ffffh 000000h?07fffh sa1 000001xxx 64/32 010000h?01ffffh 008000h?0ffffh sa2 000010xxx 64/32 020000h?02ffffh 010000h?17fffh sa3 000011xxx 64/32 030000h?03ffffh 018000h?01ffffh sa4 000100xxx 64/32 040000h?04ffffh 020000h?027fffh sa5 000101xxx 64/32 050000h?05ffffh 028000h?02ffffh sa6 000110xxx 64/32 060000h?06ffffh 030000h?037fffh sa7 000111xxx 64/32 070000h?07ffffh 038000h?03ffffh bank 3 sa8 001000xxx 64/32 080000h?08ffffh 040000h?047fffh sa9 001001xxx 64/32 090000h?09ffffh 048000h?04ffffh sa10 001010xxx 64/32 0a0000h?0affffh 050000h?057fffh sa11 001011xxx 64/32 0b0000h?0bffffh 058000h?05ffffh sa12 001100xxx 64/32 0c0000h?0cffffh 060000h?067fffh sa13 001101xxx 64/32 0d0000h?0dffffh 068000h?06ffffh sa14 001110xxx 64/32 0e0000h?0effffh 070000h?077fffh sa15 001111xxx 64/32 0f 0000h?0fffffh 078000h?07ffffh sa16 010000xxx 64/32 100000h?10ffffh 080000h?087fffh sa17 010001xxx 64/32 110000h?11ffffh 088000h?08ffffh sa18 010010xxx 64/32 120000h?12ffffh 090000h?097fffh sa19 010011xxx 64/32 130000h?13ffffh 098000h?09ffffh sa20 010100xxx 64/32 140000h?14ffffh 0a0000h?0a7fffh sa21 010101xxx 64/32 150000h?15ffffh 0a8000h?0affffh sa22 010110xxx 64/32 160000h?16ffffh 0b0000h?0b7fffh sa23 010111xxx 64/32 170000h?17ffffh 0b8000h?0bffffh sa24 011000xxx 64/32 180000h?18ffffh 0c0000h?0c7fffh sa25 011001xxx 64/32 190000h?19ffffh 0c8000h?0cffffh sa26 011010xxx 64/32 1a0000h?1affffh 0d0000h?0d7fffh sa27 011011xxx 64/32 1b0000h?1bffffh 0d8000h?0dffffh sa28 011100xxx 64/32 1c0000h?1cffffh 0e0000h?0e7fffh sa29 011101xxx 64/32 1d0000h?1dffffh 0e8000h?0effffh sa30 011110xxx 64/32 1e 0000h?1effffh 0f0000h?0f7fffh sa31 011111xxx 64/32 1f 0000h?1fffffh 0f8000h?0fffffh bank 2 sa32 100000xxx 64/32 200000h?20ffffh 100000h?107fffh sa33 100001xxx 64/32 210000h?21ffffh 108000h?10ffffh sa34 100010xxx 64/32 220000h?22ffffh 110000h?117fffh sa35 100011xxx 64/32 230000h?23ffffh 118000h?11ffffh sa36 100100xxx 64/32 240000h?24ffffh 120000h?127fffh sa37 100101xxx 64/32 250000h?25ffffh 128000h?12ffffh sa38 100110xxx 64/32 260000h?26ffffh 130000h?137fffh sa39 100111xxx 64/32 270000h?27ffffh 138000h?13ffffh sa40 101000xxx 64/32 280000h?28ffffh 140000h?147fffh sa41 101001xxx 64/32 290000h?29ffffh 148000h?14ffffh sa42 101010xxx 64/32 2a0000h?2affffh 150000h?157fffh sa43 101011xxx 64/32 2b0000h?2bffffh 158000h?15ffffh sa44 101100xxx 64/32 2c0000h?2cffffh 160000h?167fffh sa45 101101xxx 64/32 2d0000h?2dffffh 168000h?16ffffh sa46 101110xxx 64/32 2e0000h?2effffh 170000h?177fffh sa47 101111xxx 64/32 2f 0000h?2fffffh 178000h?17ffffh
july 31, 2002 am29dl320g 13 advance information note: the address range is a20:a-1 in byte mode (byte#=v il ) or a20:a0 in word mode (byte#=v ih ). the bank address bits are a20?a18 for am29dl322, a20 and a19 for am29dl323, and a20 for am29dl324. table 3. top boot secsi tm sector addresses bank 2 (continued) sa48 110000xxx 64/32 300000h?30ffffh 180000h?187fffh sa49 110001xxx 64/32 310000h?31ffffh 188000h?18ffffh sa50 110010xxx 64/32 320000h?32ffffh 190000h?197fffh sa51 110011xxx 64/32 330000h?33ffffh 198000h?19ffffh sa52 110100xxx 64/32 340000h?34ffffh 1a0000h?1a7fffh sa53 110101xxx 64/32 350000h?35ffffh 1a8000h?1affffh sa54 110110xxx 64/32 360000h?36ffffh 1b0000h?1b7fffh sa55 110111xxx 64/32 370000h?37ffffh 1b8000h?1bffffh bank 1 sa56 111000xxx 64/32 380000h?38ffffh 1c0000h?1c7fffh sa57 111001xxx 64/32 390000h?39ffffh 1c8000h?1cffffh sa58 111010xxx 64/32 3a0000h?3affffh 1d0000h?1d7fffh sa59 111011xxx 64/32 3b0000h?3bffffh 1d8000h?1dffffh sa60 111100xxx 64/32 3c0000h?3cffffh 1e0000h?1e7fffh sa61 111101xxx 64/32 3d0000h?3dffffh 1e8000h?1effffh sa62 111110xxx 64/32 3e0000h?3effffh 1f0000h?1f7fffh sa63 111111000 8/4 3f0000h?3f1fffh 1f8000h?1f8fffh sa64 111111001 8/4 3f2000h?3f3fffh 1f9000h?1f9fffh sa65 111111010 8/4 3f4000h?3f5fffh 1fa000h?1fafffh sa66 111111011 8/4 3f 6000h?3f7fffh 1fb000h?1fbfffh sa67 111111100 8/4 3f 8000h?3f9fffh 1fc000h?1fcfffh sa68 111111101 8/4 3fa 000h?3fbfffh 1fd000h?1fdfffh sa69 111111110 8/4 3fc 000h?3fdfffh 1fe000h?1fefffh sa70 111111111 8/4 3fe 000h?3fffffh 1ff000h?1fffffh table 2. top boot sector addresses (continued) sector sector address a20?a12 sector size (kbytes/kwords) (x8) address range (x16) address range device sector address a20?a12 sector size (bytes/words) (x8) address range (x16) address range am29dl32xgt 111111xxx 256/128 3fe 000h?3fe0ffh 1ff000h?1ff07fh
14 am29dl320g july 31, 2002 advance information table 4. bottom boot sector addresses sector sector address a20?a12 sector size (kbytes/kwords) (x8) address range (x16) address range bank 1 sa0 000000000 8/4 000000h?001fffh 000000h?000fffh sa1 000000001 8/4 002000h?003fffh 001000h?001fffh sa2 000000010 8/4 004000h?005fffh 002000h?002fffh sa3 000000011 8/4 006000h?007fffh 003000h?003fffh sa4 000000100 8/4 008000h?009fffh 004000h?004fffh sa5 000000101 8/4 00a000h?00bfffh 005000h?005fffh sa6 000000110 8/4 00c000h?00dfffh 006000h?006fffh sa7 000000111 8/4 00e000h?00ffffh 007000h?007fffh sa8 000001xxx 64/32 010000h?01ffffh 008000h?00ffffh sa9 000010xxx 64/32 020000h?02ffffh 010000h?017fffh sa10 000011xxx 64/32 030000h?03ffffh 018000h?01ffffh sa11 000100xxx 64/32 040000h?04ffffh 020000h?027fffh sa12 000101xxx 64/32 050000h?05ffffh 028000h?02ffffh sa13 000110xxx 64/32 060000h?06ffffh 030000h?037fffh sa14 000111xxx 64/32 070000h?07ffffh 038000h?03ffffh bank 2 sa15 001000xxx 64/32 080000h?08ffffh 040000h?047fffh sa16 001001xxx 64/32 090000h?09ffffh 048000h?04ffffh sa17 001010xxx 64/32 0a0000h?0affffh 050000h?057fffh sa18 001011xxx 64/32 0b0000h?0bffffh 058000h?05ffffh sa19 001100xxx 64/32 0c0000h?0cffffh 060000h?067fffh sa20 001101xxx 64/32 0d0000h?0dffffh 068000h?06ffffh sa21 001110xxx 64/32 0e0000h?0effffh 070000h?077fffh sa22 001111xxx 64/32 0f0000h?0fffffh 078000h?07ffffh sa23 010000xxx 64/32 100000h?10ffffh 080000h?087fffh sa24 010001xxx 64/32 110000h?11ffffh 088000h?08ffffh sa25 010010xxx 64/32 120000h?12ffffh 090000h?097fffh sa26 010011xxx 64/32 130000h?13ffffh 098000h?09ffffh sa27 010100xxx 64/32 140000h?14ffffh 0a0000h?0a7fffh sa28 010101xxx 64/32 150000h?15ffffh 0a8000h?0affffh sa29 010110xxx 64/32 160000h?16ffffh 0b0000h?0b7fffh sa30 010111xxx 64/32 170000h?17ffffh 0b8000h?0bffffh sa31 011000xxx 64/32 180000h?18ffffh 0c0000h?0c7fffh sa32 011001xxx 64/32 190000h?19ffffh 0c8000h?0cffffh sa33 011010xxx 64/32 1a0000h?1affffh 0d0000h?0d7fffh sa34 011011xxx 64/32 1b0000h?1bffffh 0d8000h?0dffffh sa35 011100xxx 64/32 1c0000h?1cffffh 0e0000h?0e7fffh sa36 011101xxx 64/32 1d0000h?1dffffh 0e8000h?0effffh sa37 011110xxx 64/32 1e00 00h?1effffh 0f0000h?0f7fffh sa38 011111xxx 64/32 1f00 00h?1fffffh 0f8000h?0fffffh bank 3 sa39 100000xxx 64/32 200000h?20ffffh 100000h?107fffh sa40 100001xxx 64/32 210000h?21ffffh 108000h?10ffffh sa41 100010xxx 64/32 220000h?22ffffh 110000h?117fffh sa42 100011xxx 64/32 230000h?23ffffh 118000h?11ffffh sa43 100100xxx 64/32 240000h?24ffffh 120000h?127fffh sa44 100101xxx 64/32 250000h?25ffffh 128000h?12ffffh sa45 100110xxx 64/32 260000h?26ffffh 130000h?137fffh sa46 100111xxx 64/32 270000h?27ffffh 138000h?13ffffh sa47 101000xxx 64/32 280000h?28ffffh 140000h?147fffh
july 31, 2002 am29dl320g 15 advance information note: the address range is a20:a-1 in byte mode (byte#=v il ) or a20:a0 in word mode (byte#=v ih ). the bank address bits are a20?a18 for am29dl322, a20 and a19 for am29dl323, and a20 for am29dl324. table 5. bottom boot secsi tm sector addresses bank 3 (continued) sa48 101001xxx 64/32 290000h?29ffffh 148000h?14ffffh sa49 101010xxx 64/32 2a0000h?2affffh 150000h?157fffh sa50 101011xxx 64/32 2b0000h?2bffffh 158000h?15ffffh sa51 101100xxx 64/32 2c0000h?2cffffh 160000h?167fffh sa52 101101xxx 64/32 2d0000h?2dffffh 168000h?16ffffh sa53 101110xxx 64/32 2e0000h?2effffh 170000h?177fffh sa54 101111xxx 64/32 2f0000h?2fffffh 178000h?17ffffh sa55 111000xxx 64/32 300000h?30ffffh 180000h?187fffh sa56 110001xxx 64/32 310000h?31ffffh 188000h?18ffffh sa57 110010xxx 64/32 320000h?32ffffh 190000h?197fffh sa58 110011xxx 64/32 330000h?33ffffh 198000h?19ffffh sa59 110100xxx 64/32 340000h?34ffffh 1a0000h?1a7fffh sa60 110101xxx 64/32 350000h?35ffffh 1a8000h?1affffh sa61 110110xxx 64/32 360000h?36ffffh 1b0000h?1b7fffh sa62 110111xxx 64/32 370000h?37ffffh 1b8000h?1bffffh bank 4 sa63 111000xxx 64/32 380000h?38ffffh 1c0000h?1c7fffh sa64 111001xxx 64/32 390000h?39ffffh 1c8000h?1cffffh sa65 111010xxx 64/32 3a0000h?3affffh 1d0000h?1d7fffh sa66 111011xxx 64/32 3b0000h?3bffffh 1d8000h?1dffffh sa67 111100xxx 64/32 3c00 00h?3cffffh 1e0000h?1e7fffh sa68 111101xxx 64/32 3d00 00h?3dffffh 1e8000h?1effffh sa69 111110xxx 64/32 3e00 00h?3effffh 1f0000h?1f7fffh sa70 111111xxx 64/32 3f00 00h?3fffffh 1f8000h?1fffffh device sector address a20?a12 sector size (bytes/words) (x8) address range (x16) address range am29dl32xgb 000000xxx 256/128 000000h?0000ffh 00000h?00007fh table 4. bottom boot sector addresses (continued) sector sector address a20?a12 sector size (kbytes/kwords) (x8) address range (x16) address range
16 am29dl320g july 31, 2002 advance information autoselect mode the autoselect mode provides manufacturer and de- vice identification, and sect or protection verification, through identifier codes output on dq7?dq0. this mode is primarily intended for programming equip- ment to automatically match a device to be pro- grammed with its corresponding programming algorithm. however, the autoselect codes can also be accessed in-system through the command register. when using programming equipment, the autoselect mode requires v id (8.5 v to 12.5 v) on address pin a9. address pins a6, a1, and a0 must be as shown in table 6 . in addition, when verifying sector protection, the sector address must appear on the appropriate highest order address bits (see ta b l e 2 ). ta b le 6 shows the remaining address bits that are don?t care. when all necessary bits have been set as required, the programming equipment may then read the corre- sponding identifier code on dq7?dq0. to access the autoselect codes in-system, the host system can issue the autoselect command via the command register, as shown in table 13 . this method does not require v id . refer to the autoselect com- mand sequence section for more information. table 6. autoselect codes, (high voltage method) legend: t = top boot block, b = bottom boot block, l = logic low = v il , h = logic high = v ih , ba = bank address, sa = sector address, x = don?t care. notes: 1. the bank address bits are a20?a18. 2. the device id must be read across three cycles. description ce# oe# we# a20 to a12 a11 to a10 a9 a8 to a7 a6 a5 to a4 a3 a2 a1 a0 dq15 to dq8 dq7 to dq0 byte# = v ih byte# = v il manufacturer id : amd llhbax v id x l x x x l l x x 01h device id read cycle 1 l l h ba x v id xlxlllh 22h x 7eh read cycle 2 l l h ba x v id x l xhhhl 22h x 0ah read cycle 3 l l h ba x v id x l x h h h h 22h x 01h (t), 00h (b) sector protection verification llhsax v id xlxxxhl x x 01h (protected), 00h (unprotected) secsi ? indicator bit (dq7) llhbax v id xlxxxhh x x 81h (factory locked), 01h (not factory locked)
july 31, 2002 am29dl320g 17 advance information sector/sector block protection and unprotection (note: for the following discussion, the term ?sector? applies to both sectors and sector blocks. a sector block consists of two or more adjacent sectors that are protected or unprotected at the same time (see tables 2 and 4 ). the hardware sector protection feature disables both program and erase operations in any sector. the hard- ware sector unprotection feature re-enables both pro- gram and erase operations in previously protected sectors. sector protection/unprotection can be imple- mented via two methods. table 7. top boot sector/sector block addresses for protection/unprotection table 8. bottom boot sector/sector block addresses for protection/unprotection the primary method requires v id on the reset# pin only, and can be implemented either in-system or via programming equipment. figure 2 shows the algo- rithms and figure 25 shows the timing diagram. this method uses standard microprocessor bus cycle tim- ing. for sector unprotect, all unprotected sectors must first be protected prior to the first sector unprotect write cycle. the sector unprotect algorithm unprotects all sectors in parallel. all previously protected sectors must be in- dividually re-protected. to change data in protected sectors efficiently, the temporary sector unprotect function is available. see ?temporary sector unpro- tect? . sector a20?a12 sector/ sector block size sa0 000000xxx 64 kbytes sa1-sa3 000001xxx, 000010xxx 000011xxx 192 (3x64) kbytes sa4-sa7 0001xxxxx 256 (4x64) kbytes sa8-sa11 0010xxxxx 256 (4x64) kbytes sa12-sa15 0011xxxxx 256 (4x64) kbytes sa16-sa19 0100xxxxx 256 (4x64) kbytes sa20-sa23 0101xxxxx 256 (4x64) kbytes sa24-sa27 0110xxxxx 256 (4x64) kbytes sa28-sa31 0111xxxxx 256 (4x64) kbytes sa32-sa35 1000xxxxx 256 (4x64) kbytes sa36-sa39 1001xxxxx 256 (4x64) kbytes sa40-sa43 1010xxxxx 256 (4x64) kbytes sa44-sa47 1011xxxxx 256 (4x64) kbytes sa48-sa51 1100xxxxx 256 (4x64) kbytes sa52-sa55 1101xxxxx 256 (4x64) kbytes sa56-sa59 1110xxxxx 256 (4x64) kbytes sa60-sa62 111100xxx, 111101xxx, 111110xxx 192 (3x64) kbytes sa63 11111 1000 8 kbytes sa64 11111 1001 8 kbytes sa65 11111 1010 8 kbytes sa66 111111011 8 kbytes sa67 111111100 8 kbytes sa68 111111101 8 kbytes sa69 111111110 8 kbytes sa70 111111111 8 kbytes sector a20?a12 sector/sector block size sa70 111111xxx 64 kbytes sa69-sa67 111110xxx, 111101xxx, 111100xxx 192 (3x64) kbytes sa66-sa63 1110xxxxx 256 (4x64) kbytes sa62-sa59 1101xxxxx 256 (4x64) kbytes sa58-sa55 1100xxxxx 256 (4x64) kbytes sa54-sa51 1011xxxxx 256 (4x64) kbytes sa50-sa47 1010xxxxx 256 (4x64) kbytes sa46-sa43 1001xxxxx 256 (4x64) kbytes sa42-sa39 1000xxxxx 256 (4x64) kbytes sa38-sa35 0111xxxxx 256 (4x64) kbytes sa34-sa31 0110xxxxx 256 (4x64) kbytes sa30-sa27 0101xxxxx 256 (4x64) kbytes sa26-sa23 0100xxxxx 256 (4x64) kbytes sa22?sa19 0011xxxxx 256 (4x64) kbytes sa18-sa15 0010xxxxx 256 (4x64) kbytes sa14-sa11 0001xxxxx 256 (4x64) kbytes sa10-sa8 000011xxx, 000010xxx, 000001xxx 192 (3x64) kbytes sa7 000000111 8 kbytes sa6 000000110 8 kbytes sa5 000000101 8 kbytes sa4 000000100 8 kbytes sa3 000000011 8 kbytes sa2 000000010 8 kbytes sa1 000000001 8 kbytes sa0 000000000 8 kbytes
18 am29dl320g july 31, 2002 advance information the alternate method intended only for programming equipment requires v id on address pin a9 and oe#. this method is compatible with programmer routines written for earlier 3.0 volt-only amd flash devices. publication number 22244 contains further details; contact an amd representative to request a copy. the device is shipped with all sectors unprotected. amd offers the option of programming and protecting sectors at its factory prior to shipping the device through amd?s expressflash? service. contact an amd representative for details. it is possible to determine whether a sector is pro- tected or unprotected. see the autoselect mode sec- tion for details. write protect (wp#) the write protect function provides a hardware method of protecting certain boot sectors without using v id . this function is one of two provided by the wp#/acc pin. if the system asserts v il on the wp#/acc pin, the de- vice disables program and erase functions in the two ?outermost? 8 kbyte boot sectors independently of whether those sectors were protected or unprotected using the method described in ?sector/sector block protection and unprotection?. the two outermost 8 kbyte boot sectors are the two sectors containing the lowest addresses in a bottom-boot-configured device, or the two sectors containing the highest addresses in a top-boot-configured device. if the system asserts v ih on the wp#/acc pin, the de- vice reverts to whether the two outermost 8k byte boot sectors were last set to be protected or unpro- tected. that is, sector protection or unprotection for these two sectors depends on whether they were last protected or unprotected using the method described in ?sector/sector block protection and unprotection?. note that the wp#/acc pin must not be left floating or unconnected; inconsistent behavior of the device may result. temporary sector unprotect (note: for the following discussion, the term ?sector? applies to both sectors and sector blocks. a sector block consists of two or more adjacent sectors that are protected or unprotected at the same time (tables 2 and 4 ). this feature allows temporary unprotection of previ- ously protected sectors to change data in-system. the sector unprotect mode is activated by setting the re- set# pin to v id . during this mode, formerly protected sectors can be programmed or erased by selecting the sector addresses. once v id is removed from the re- set# pin, all the previously protected sectors are protected again. figure 1 shows the algorithm, and figure 24 shows the timing diagrams, for this feature. figure 1. temporary sector unprotect operation start perform erase or program operations reset# = v ih temporary sector unprotect completed (note 2) reset# = v id (note 1) notes: 1. all protected sectors u nprotected (if wp#/acc = v il , outermost boot sectors will remain protected). 2. all previously protected sectors are protected once again.
july 31, 2002 am29dl320g 19 advance information figure 2. in-system sector protection/ sector unprotection algorithms sector protect: write 60h to sector address with a6 = 0, a1 = 1, a0 = 0 set up sector address wait 150 s verify sector protect: write 40h to sector address with a6 = 0, a1 = 1, a0 = 0 read from sector address with a6 = 0, a1 = 1, a0 = 0 start plscnt = 1 reset# = v id wait 1 s first write cycle = 60h? data = 01h? remove v id from reset# write reset command sector protect complete yes yes no plscnt = 25? yes device failed increment plscnt temporary sector unprotect mode no sector unprotect: write 60h to any address with a6 = 1, a1 = 1, a0 = 0 set up first sector address wait 15 ms verify sector unprotect: write 40h to sector address with a6 = 1, a1 = 1, a0 = 0 read from sector address with a6 = 1, a1 = 1, a0 = 0 start plscnt = 1 reset# = v id wait 1 s data = 00h? last sector verified? remove v id from reset# write reset command sector unprotect complete yes no plscnt = 1000? yes device failed increment plscnt temporary secto r unprotect mode no all sectors protected? yes protect all sectors: the indicated portion of the sector protect algorithm must be performed for all unprotected sectors prior to issuing the first sector unprotect address set up next sector address no yes no yes no no yes no s ector protect algorithm sector unprotect algorithm first write cycle = 60h? protect another sector? reset plscnt = 1
20 am29dl320g july 31, 2002 advance information secsi tm (secured silicon) sector flash memory region the secsi (secured silicon) sector feature provides a 256-byte flash memory region that enables perma- nent part identification through an electronic serial number (esn). the secsi sector uses a secsi sector indicator bit (dq7) to indicate whether or not the secsi sector is locked when shipped from the factory. this bit is permanently set at the factory and cannot be changed, which prevents cloning of a factory locked part. this ensures the security of the esn once the product is shipped to the field. amd offers the device with the secsi sector either factory locked or customer lockable. the fac- tory-locked version is always protected when shipped from the factory, and has the secsi (secured silicon) sector indicator bit permanently set to a ?1.? the cus- tomer-lockable version is shipped with the secsi sec- tor unprotected, allowing customers to utilize the that sector in any manner they choose. the customer-lock- able version has the secsi (secured silicon) sector indicator bit permanently set to a ?0.? thus, the secsi sector indicator bit prevents customer-lockable de- vices from being used to replace devices that are fac- tory locked. the system accesses the secsi sector through a command sequence (see ?enter secsi tm sector/exit secsi sector command sequence?). after the system has written the enter secsi sector command se- quence, it may read the secsi sector by using the ad- dresses normally occupied by the boot sectors. this mode of operation continues until the system issues the exit secsi sector command sequence, or until power is removed from the device. on power-up, or following a hardware reset, the device reverts to send- ing commands to the boot sectors. factory locked: secsi sector programmed and protected at the factory in a factory locked device, the secsi sector is pro- tected when the device is shipped from the factory. the secsi sector cannot be modified in any way. the device is available preprogrammed with one of the fol- lowing: a random, secure esn only customer code through the expressflash service both a random, secure esn and customer code through the expressflash service. in devices that have an esn, a bottom boot device will have the 16-byte esn at addresses 000000h?000007h in word mode (or 000000h?00000fh in byte mode). in the top boot de- vice the esn will be at addresses 1ff000h?1ff007fh in word mode (or addresses 3fe000h?3fe0ffh in byte mode). customers may opt to have their code programmed by amd through the amd expressflash service. amd programs the customer?s code, with or without the ran- dom esn. the devices are then shipped from amd?s factory with the secsi sector permanently locked. contact an amd representative for details on using amd?s expressflash service. customer lockable: secsi sector not programmed or protected at the factory if the security feature is not required, the secsi sector can be treated as an additi onal 256-byte flash mem- ory space, expanding the size of the available flash array. additionally, note the difference in the loca- tion of the esn compared to previous am29dl32x top boot factory locked devices. the secsi sector is one-time programmable, may not be erased, and can be locked only once. note that the accelerated programming (acc) and unlock bypass functions are not available when programming the secsi sector. the secsi sector area can be protected using one of the following procedures: write the three-cycle enter secsi sector region command sequence, and then follow the in-system sector protect algorithm as shown in figure 2 , ex- cept that reset# may be at either v ih or v id . this allows in-system protection of the secsi sector without raising any device pin to a high voltage. note that this method is only applicable to the secsi sector write the three-cycle enter secsi sector region command sequence, and then use the alternate method of sector protection described in the ?sec- tor/sector block protection and unprotection? sec- tion. the secsi sector is one-time programmable. once the secsi sector is locked and verified, the system must write the exit secsi sector region command se- quence to return to reading and writing the remainder of the array. the secsi sector protection must be used with cau- tion since, once protected, there is no procedure avail- able for unprotecting the secsi sector area and none of the bits in the secsi sector memory space can be modified in any way. hardware data protection the command sequence requirement of unlock cycles for programming or erasing provides data protection against inadvertent writes (refer to table 13 for com- mand definitions). in addition, the following hardware data protection measures pr event accidental erasure or programming, which might otherwise be caused by spurious system level signals during v cc power-up and power-down transitions, or from system noise.
july 31, 2002 am29dl320g 21 advance information low v cc write inhibit when v cc is less than v lko , the device does not ac- cept any write cycles. this protects data during v cc power-up and power-down. the command register and all internal program/erase circuits are disabled, and the device resets to the read mode. subsequent writes are ignored until v cc is greater than v lko . the system must provide the proper signals to the control pins to prevent unintentional writes when v cc is greater than v lko . write pulse ?glitch? protection noise pulses of less than 5 ns (typical) on oe#, ce# or we# do not initiate a write cycle. logical inhibit write cycles are inhibited by holding any one of oe# = v il , ce# = v ih or we# = v ih . to initiate a write cycle, ce# and we# must be a logical zero while oe# is a logical one. power-up write inhibit if we# = ce# = v il and oe# = v ih during power up, the device does not accept commands on the rising edge of we#. the internal state machine is automati- cally reset to the read mode on power-up. common flash memo ry interface (cfi) the common flash interface (cfi) specification out- lines device and host system software interrogation handshake, which allows specific vendor-specified software algorithms to be used for entire families of devices. software support can then be device-inde- pendent, jedec id-independent, and forward- and backward-compatible for the specified flash device families. flash vendors can standardize their existing interfaces for long-term compatibility. this device enters the cfi query mode when the sys- tem writes the cfi query command, 98h, to address 55h in word mode (or address aah in byte mode), any time the device is ready to read array data. the system can read cfi information at the addresses given in tables 9 ? 12 . to terminate reading cfi data, the system must write the reset command. the cfi query mode is not accessible when the device is exe- cuting an embedded program or embedded erase al- gorithm. the system can also write the cfi query command when the device is in the autoselect mode. the device enters the cfi query mode, and the system can read cfi data at the addresses given in tables 9 ? 12 . the system must write the reset command to return the de- vice to the autoselect mode. for further information, please refer to the cfi specifi- cation and cfi publication 100, available via the world wide web at http://www.amd.com/us-en/as- sets/content_type/downloadableassets/cfiamd1.pdf or http://www.amd.com/us-en/assets/content_type/ downloadableassets/cfi100.pdf. alternatively, contact an amd representative for copies of these documents. table 9. cfi query identification string addresses (word mode) addresses (byte mode) data description 10h 11h 12h 20h 22h 24h 0051h 0052h 0059h query unique ascii string ?qry? 13h 14h 26h 28h 0002h 0000h primary oem command set 15h 16h 2ah 2ch 0040h 0000h address for primary extended table 17h 18h 2eh 30h 0000h 0000h alternate oem command set (00h = none exists) 19h 1ah 32h 34h 0000h 0000h address for alternate oem extended table (00h = none exists)
22 am29dl320g july 31, 2002 advance information table 10. system interface string table 11. device geometry definition addresses (word mode) addresses (byte mode) data description 1bh 36h 0027h v cc min. (write/erase) d7?d4: volt, d3?d0: 100 millivolt 1ch 38h 0036h v cc max. (write/erase) d7?d4: volt, d3?d0: 100 millivolt 1dh 3ah 0000h v pp min. voltage (00h = no v pp pin present) 1eh 3ch 0000h v pp max. voltage (00h = no v pp pin present) 1fh 3eh 0004h typical timeout per single byte/word write 2 n s 20h 40h 0000h typical timeout for min. size buffer write 2 n s (00h = not supported) 21h 42h 000ah typical timeout per individual block erase 2 n ms 22h 44h 0000h typical timeout for full chip erase 2 n ms (00h = not supported) 23h 46h 0005h max. timeout for byte/word write 2 n times typical 24h 48h 0000h max. timeout for buffer write 2 n times typical 25h 4ah 0004h max. timeout per individual block erase 2 n times typical 26h 4ch 0000h max. timeout for full chip erase 2 n times typical (00h = not supported) addresses (word mode) addresses (byte mode) data description 27h 4eh 0016h device size = 2 n byte 28h 29h 50h 52h 0002h 0000h flash device interface description (refer to cfi publication 100) 2ah 2bh 54h 56h 0000h 0000h max. number of bytes in multi-byte write = 2 n (00h = not supported) 2ch 58h 0002h number of erase block regions within device 2dh 2eh 2fh 30h 5ah 5ch 5eh 60h 0007h 0000h 0020h 0000h erase block region 1 information (refer to the cfi specification or cfi publication 100) 31h 32h 33h 34h 62h 64h 66h 68h 003eh 0000h 0000h 0001h erase block region 2 information 35h 36h 37h 38h 6ah 6ch 6eh 70h 0000h 0000h 0000h 0000h erase block region 3 information 39h 3ah 3bh 3ch 72h 74h 76h 78h 0000h 0000h 0000h 0000h erase block region 4 information
july 31, 2002 am29dl320g 23 advance information table 12. primary vendor-specific extended query command definitions writing specific address and data commands or se- quences into the command register initiates device op- erations. table 13 defines the valid register command sequences. writing incorrect address and data val- ues or writing them in the improper sequence resets the device to reading array data. all addresses are latched on the falling edge of we# or ce#, whichever happens later. all data is latched on the rising edge of we# or ce#, whichever happens first. refer to the ac characteristics section for timing diagrams. reading array data the device is automatically set to reading array data after device power-up. no commands are required to retrieve data. each bank is ready to read array data after completing an embedded program or embedded erase algorithm. after the device accepts an erase suspend command, the corresponding bank enters the erase-sus- pend-read mode, after which the system can read data from any non-erase-suspended sector within the same bank. after completing a programming operation in the erase suspend mode, the system may once again read array data with the same exception. see the erase suspend/erase resume commands sec- tion for more information. the system must issue the reset command to return a bank to the read (or erase-suspend-read) mode if dq5 goes high during an active program or erase opera- tion, or if the bank is in the autoselect mode. see the next section, reset command, for more information. addresses (word mode) addresses (byte mode) data description 40h 41h 42h 80h 82h 84h 0050h 0052h 0049h query-unique ascii string ?pri? 43h 86h 0031h major version number, ascii 44h 88h 0033h minor version number, ascii 45h 8ah 0001h silicon revision number 00h = 0.23 m, 01h = 0.17 m 46h 8ch 0002h erase suspend 0 = not supported, 1 = to read only, 2 = to read & write 47h 8eh 0001h sector protect 0 = not supported, x = number of sectors in per group 48h 90h 0001h sector temporary unprotect 00 = not supported, 01 = supported 49h 92h 0004h sector protect/unprotect scheme 04 = 29lv800 mode 4ah 94h 0038h simultaneous operation number of sectors (excluding bank 1) 4bh 96h 0000h burst mode type 00 = not supported, 01 = supported 4ch 98h 0000h page mode type 00 = not supported, 01 = 4 word page, 02 = 8 word page 4dh 9ah 0085h acc (acceleration) supply minimum 00h = not supported, d7-d4: volt, d3-d0: 100 mv 4eh 9ch 0095h acc (acceleration) supply maximum 00h = not supported, d7-d4: volt, d3-d0: 100 mv 4fh 9eh 000xh top/bottom boot sector flag 02h = bottom boot device, 03h = top boot device
24 am29dl320g july 31, 2002 advance information see also requirements for reading array data in the device bus operations section for more information. the read-only operations table provides the read pa- rameters, and figure 13 shows the timing diagram. reset command writing the reset command resets the banks to the read or erase-suspend-read mode. address bits are don?t cares for this command. the reset command may be written between the se- quence cycles in an erase command sequence before erasing begins. this resets the bank to which the sys- tem was writing to the read mode. once erasure be- gins, however, the device ignores reset commands until the operation is complete. the reset command may be written between the sequence cycles in a program command sequence before programming begins. this resets the bank to which the system was writing to the read mode. if the program command sequence is written to a bank that is in the erase suspend mode, writing the reset command returns that bank to the erase-sus- pend-read mode. once programming begins, how- ever, the device ignores reset commands until the operation is complete. the reset command may be written between the se- quence cycles in an autoselect command sequence. once in the autoselect mode, the reset command must be written to return to the read mode. if a bank entered the autoselect mode while in the erase sus- pend mode, writing the reset command returns that bank to the erase-suspend-read mode. if dq5 goes high during a program or erase operation, writing the reset command returns the banks to the read mode (or erase-suspend-read mode if that bank was in erase suspend). autoselect command sequence the autoselect command sequence allows the host system to access the manufacturer and device codes, and determine whether or not a sector is protected. table 13 shows the address and data requirements. this method is an alternative to that shown in table 6 , which is intended for prom programmers and re- quires v id on address pin a9. the autoselect com- mand sequence may be written to an address within a bank that is either in the read or erase-suspend-read mode. the autoselect command may not be written while the device is actively programming or erasing in the other bank. the autoselect command sequence is initiated by first writing two unlock cycles. this is followed by a third write cycle that contains the bank address and the au- toselect command. the bank then enters the autose- lect mode. the system may read at any address within the same bank any number of times without initiating another autoselect command sequence: a read cycle at address (ba)xx00h (where ba is the bank address) returns the manufacturer code. a read cycle at address (ba)xx01h in word mode (or (ba)xx02h in byte mode) returns the device code. a read cycle to an address containing a sector ad- dress (sa) within the same bank, and the address 02h on a7?a0 in word mode (or the address 04h on a6?a-1 in byte mode) returns 01h if the sector is protected, or 00h if it is unprotected. (refer to ta b l e 2 for valid sector addresses). the system must write the reset command to return to the read mode (or erase-suspend-read mode if the bank was previously in erase suspend). enter secsi tm sector/exit secsi sector command sequence the secsi sector region provides a secured data area containing a random, sixteen- byte electronic serial number (esn). the system can access the secsi sector region by issuing the three-cycle enter secsi sector command sequence. the device continues to access the secsi sector region until the system is- sues the four-cycle exit secsi sector command se- quence. the exit secsi sector command sequence returns the device to normal operation. the secsi sector is not accessible when the device is executing an embedded program or embedded erase algo- rithm. table 13 shows the address and data require- ments for both command sequences. see also ?secsi tm (secured silicon) sector flash memory region? for further information. byte/word program command sequence the system may program the device by word or byte, depending on the state of the byte# pin. program- ming is a four-bus-cycle operation. the program com- mand sequence is initiated by writing two unlock write cycles, followed by the program set-up command. the program address and data are written next, which in turn initiate the embedded program algorithm. the system is not required to provide further controls or timings. the device automatically provides internally generated program pulses and verifies the pro- grammed cell margin. table 13 shows the address and data requirements for the byte program command sequence. when the embedded program algorithm is complete, that bank then returns to the read mode and ad- dresses are no longer latched. the system can deter- mine the status of the program operation by using dq7, dq6, or ry/by#. refer to the write operation status section for information on these status bits.
july 31, 2002 am29dl320g 25 advance information any commands written to the device during the em- bedded program algorithm are ignored. note that a hardware reset immediately terminates the program operation. the program command sequence should be reinitiated once that bank has returned to the read mode, to ensure data integrity. programming is allowed in any sequence and across sector boundaries. a bit cannot be programmed from ?0? back to a ?1.? attempting to do so may cause that bank to set dq5 = 1, or cause the dq7 and dq6 status bits to indicate the operation was success- ful. however, a succeeding read will show that the data is still ?0.? only er ase operations can convert a ?0? to a ?1.? unlock bypass command sequence the unlock bypass feature allows the system to pro- gram bytes or words to a bank faster than using the standard program command sequence. the unlock bypass command sequence is initiated by first writing two unlock cycles. this is followed by a third write cycle containing the unlock bypass command, 20h. that bank then enters the unlock bypass mode. a two-cycle unlock bypass program command sequence is all that is required to program in this mode. the first cycle in this sequence contains the unlock bypass pro- gram command, a0h; the second cycle contains the program address and data. additional data is pro- grammed in the same manner. this mode dispenses with the initial two unlock cycles required in the stan- dard program command sequence, resulting in faster total programming time. table 13 shows the require- ments for the command sequence. during the unlock bypass mode, only the unlock by- pass program and unlock bypass reset commands are valid. to exit the unlock bypass mode, the system must issue the two-cycle unlock bypass reset com- mand sequence. the first cycle must contain the bank address and the data 90h. the second cycle need only contain the data 00h. the bank then returns to the read mode. the device offers accelerated program operations through the wp#/acc pin. when the system asserts v hh on the wp#/acc pin, the device automatically en- ters the unlock bypass mode. the system may then write the two-cycle unlock bypass program command sequence. the device uses the higher voltage on the wp#/acc pin to accelerate the operation. note that the wp#/acc pin must not be at v hh any operation other than accelerated programming, or device dam- age may result. in addition, the wp#/acc pin must not be left floating or unconnected; inconsistent behavior of the device may result. figure 3 illustrates the algorithm for the program oper- ation. refer to the erase and program operations table in the ac characteristics section for parameters, and figure 17 for timing diagrams. figure 3. program operation chip erase command sequence chip erase is a six bus cycle operation. the chip erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. two additional unlock write cycles are then followed by the chip erase command, which in turn invokes the embedded erase algorithm. the device does not require the system to preprogram prior to erase. the embedded erase algo- rithm automatically preprograms and verifies the entire memory for an all zero data pattern prior to electrical erase. the system is not required to provide any con- trols or timings during these operations. table 13 shows the address and data requirements for the chip erase command sequence. when the embedded erase algorithm is complete, that bank returns to the read mode and addresses are no longer latched. the system can determine the sta- tus of the erase operation by using dq7, dq6, dq2, start write program command sequence data poll from system verify data? no yes last address? no yes programming completed increment address embedded program algorithm in progress note: see table 13 for program command sequence.
26 am29dl320g july 31, 2002 advance information or ry/by#. refer to the write operation status sec- tion for information on these status bits. any commands written during the chip erase operation are ignored. however, note that a hardware reset im- mediately terminates the erase operation. if that oc- curs, the chip erase command sequence should be reinitiated once that bank has returned to reading array data, to ensure data integrity. figure 4 illustrates the algorithm for the erase opera- tion. refer to the erase and program operations ta- bles in the ac characteristics section for parameters, and figure 19 section for timing diagrams. sector erase command sequence sector erase is a six bus cycle operation. the sector erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. two ad- ditional unlock cycles are written, and are then fol- lowed by the address of the sector to be erased, and the sector erase command. table 13 shows the ad- dress and data requirements for the sector erase com- mand sequence. the device does not require the system to preprogram prior to erase. the embedded erase algorithm auto- matically programs and verifies the entire memory for an all zero data pattern prior to electrical erase. the system is not required to provide any controls or tim- ings during these operations. after the command sequence is written, a sector erase time-out of 50 s occurs. during the time-out period, additional sector addresses and sector erase com- mands (for sectors within the same bank) may be writ- ten. loading the sector erase buffer may be done in any sequence, and the number of sectors may be from one sector to all sectors. the time between these ad- ditional cycles must be less than 50 s, otherwise era- sure may begin. any sector erase address and command following the exceeded time-out may or may not be accepted. it is recommended that proces- sor interrupts be disabled during this time to ensure all commands are accepted. the interrupts can be re-en- abled after the last sector erase command is written. any command other than sector erase or erase suspend during the time-out period resets that bank to the read mode. the system must rewrite the command sequence and any additional addresses and commands. the system can monitor dq3 to determine if the sec- tor erase timer has timed out (see the section on dq3: sector erase timer.). the time-out begins from the ris- ing edge of the final we# pulse in the command sequence. when the embedded erase algorithm is complete, the bank returns to reading array data and addresses are no longer latched. note that while the embedded erase operation is in progr ess, the system can read data from the non-erasing bank. the system can de- termine the status of the erase operation by reading dq7, dq6, dq2, or ry/by# in the erasing bank. refer to the write operation status section for infor- mation on these status bits. once the sector erase operation has begun, only the erase suspend command is valid. all other com- mands are ignored. however, note that a hardware reset immediately terminates the erase operation. if that occurs, the sector erase command sequence should be reinitiated once that bank has returned to reading array data, to ensure data integrity. figure 4 illustrates the algorithm for the erase opera- tion. refer to the erase and program operations ta- bles in the ac characteristics section for parameters, and figure 19 section for timing diagrams. erase suspend/erase resume commands the erase suspend command, b0h, allows the sys- tem to interrupt a sector erase operation and then read data from, or program data to, any sector not selected for erasure. the bank address is required when writing this command. this command is valid only during the sector erase operation, including the 50 s time-out period during the sector erase command sequence. the erase suspend command is ignored if written dur- ing the chip erase operation or embedded program algorithm. when the erase suspend command is written during the sector erase operation, the device requires a max- imum of 20 s to suspend the erase operation. how- ever, when the erase suspend command is written during the sector erase time-out, the device immedi- ately terminates the time-out period and suspends the erase operation. after the erase operation has been suspended, the bank enters the erase-suspend-read mode. the sys- tem can read data from or program data to any sector not selected for erasure. (the device ?erase sus- pends? all sectors selected for erasure.) reading at any address within erase-suspended sectors pro- duces status information on dq7?dq0. the system can use dq7, or dq6 and dq2 together, to determine if a sector is actively erasing or is erase-suspended. refer to the write operation status section for infor- mation on these status bits. after an erase-suspended program operation is com- plete, the bank returns to the erase-suspend-read mode. the system can determine the status of the program operation using the dq7 or dq6 status bits, just as in the standard byte program operation. refer to the write operation status section for more information.
july 31, 2002 am29dl320g 27 advance information in the erase-suspend-read mode, the system can also issue the autoselect command sequence. refer to the autoselect mode and autoselect command sequence sections for details. to resume the sector erase operation, the system must write the erase resume command. the bank address of the erase-suspended bank is required when writing this command. further writes of the re- sume command are ignored. another erase suspend command can be written after the chip has resumed erasing. figure 4. erase operation start write erase command sequence (notes 1, 2) data poll to erasing bank from system data = ffh? no yes erasure completed embedded erase algorithm in progress notes: 1. see table 13 for erase command sequence. 2. see the section on dq3 for information on the sector erase timer.
28 am29dl320g july 31, 2002 advance information table 13. command definitions legend: x = don?t care ra = address of the memory location to be read. rd = data read from location ra during read operation. pa = address of the memory location to be programmed. addresses latch on the falling edge of the we# or ce# pulse, whichever happens later. pd = data to be programmed at location pa. data latches on the rising edge of we# or ce# pulse, whichever happens first. sa = address of the sector to be verified (in autoselect mode) or erased. address bits a20?a12 uniquely select any sector. ba = address of the bank that is being switched to autoselect mode, is in bypass mode, or is being erased. notes: 1. see table 1 for description of bus operations. 2. all values are in hexadecimal. 3. except for the read cycle and the fourth cycle of the autoselect command sequence, all bus cycles are write cycles. 4. data bits dq15?dq8 are don?t care in command sequences, except for rd and pd. 5. unless otherwise noted, address bits a20?a11 are don?t cares. 6. no unlock or command cycles required when bank is reading array data. 7. the reset command is required to return to the read mode (or to the erase-suspend-read mode if previously in erase suspend) when a bank is in the autoselect mode, or if dq5 goes high (while the bank is providing status information). 8. the fourth cycle of the autoselect command sequence is a read cycle. the system must provide the bank address to obtain the manufacturer id, device id, or secsi sector factory protect information. data bits dq15?dq8 are don?t care. see the autoselect command sequence section for more information. 9. the device id must be read across three cycles. the device id is 00h for bottom boot devices, and 01h for top boot devices. 10. the data is 81h for factory locked and 01h for not factory locked. 11. the data is 00h for an unprotected sector/sector block and 01h for a protected sector/sector block. 12. the unlock bypass command is required prior to the unlock bypass program command. 13. the unlock bypass reset command is required to return to the read mode when the bank is in the unlock bypass mode. 14. the system may read and program in non-erasing sectors, or enter the autoselect mode, when in the erase suspend mode. the erase suspend command is valid only during a sector erase operation, and requires the bank address. 15. the erase resume command is valid only during the erase suspend mode, and requires the bank address. 16. command is valid when device is ready to read array data or when device is in autoselect mode. command sequence (note 1) cycles bus cycles (notes 2?5) first second third fourth fifth sixth addr data addr data addr data addr data addr data addr data read (note 6) 1 ra rd reset (note 7) 1 xxx f0 autoselect (note 8) manufacturer id word 4 555 aa 2aa 55 (ba)555 90 (ba)x00 01 byte aaa 555 (ba)aaa device id (note 9) word 4 555 aa 2aa 55 (ba)555 90 (ba)x01 7e (ba)x0e 0a (ba)x0f 00/ 01 byte aaa 555 (ba)aaa (ba)x02 (ba)x1c (ba)x1e secsi ? sector factory protect (note 10) word 4 555 aa 2aa 55 (ba)555 90 (ba)x03 81/01 byte aaa 555 (ba)aaa (ba)x06 sector/sector block protect verify (note 11) word 4 555 aa 2aa 55 (ba)555 90 (sa)x02 00/01 byte aaa 555 (ba)aaa (sa)x04 enter secsi sector region word 3 555 aa 2aa 55 555 88 byte aaa 555 aaa exit secsi sector region word 4 555 aa 2aa 55 555 90 xxx 00 byte aaa 555 aaa program word 4 555 aa 2aa 55 555 a0 pa pd byte aaa 555 aaa unlock bypass word 3 555 aa 2aa 55 555 20 byte aaa 555 aaa unlock bypass program (note 12) 2 xxx a0 pa pd unlock bypass reset (note 13) 2 ba 90 xxx 00 chip erase word 6 555 aa 2aa 55 555 80 555 aa 2aa 55 555 10 byte aaa 555 aaa aaa 555 aaa sector erase word 6 555 aa 2aa 55 555 80 555 aa 2aa 55 sa 30 byte aaa 555 aaa aaa 555 erase suspend (note 14) 1 ba b0 erase resume (note 15) 1 ba 30 cfi query (note 16) word 1 55 98 byte aa
july 31, 2002 am29dl320g 29 advance information write operation status the device provides several bits to determine the status of a program or erase operation: dq2, dq3, dq5, dq6, and dq7. table 14 and the following subsections describe the function of these bits. dq7 and dq6 each offer a method for determining whether a program or erase operation is complete or in progress. the device also provides a hard- ware-based output signal, ry/by#, to determine whether an embedded program or erase operation is in progress or has been completed. dq7: data# polling the data# polling bit, dq7, indicates to the host system whether an embedded program or erase algorithm is in progress or completed, or whether a bank is in erase sus- pend. data# polling is valid after the rising edge of the final we# pulse in the command sequence. during the embedded program algorithm, the device out- puts on dq7 the complement of the datum programmed to dq7. this dq7 status also applies to programming during erase suspend. when the embedded program algorithm is complete, the device outputs the datum programmed to dq7. the system must provide the program address to read valid status information on dq7. if a program address falls within a protected sector, data# polling on dq7 is ac- tive for approximately 1 s, then that bank returns to the read mode. during the embedded erase algorithm, data# polling produces a ?0? on dq7. when the embedded erase algorithm is complete, or if the bank enters the erase suspend mode, data# polling produces a ?1? on dq7. the system must provide an address within any of the sectors selected for erasure to read valid status infor- mation on dq7. after an erase command sequence is written, if all sectors selected for erasing are protected, data# poll- ing on dq7 is active for approximately 100 s, then the bank returns to the read mode. if not all selected sectors are protected, the embedded erase algorithm erases the unprotected sectors, and ignores the se- lected sectors that are protected. however, if the sys- tem reads dq7 at an address within a protected sector, the status may not be valid. just prior to the completion of an embedded program or erase operation, dq7 may change asynchronously with dq0?dq6 while output enable (oe#) is asserted low. that is, the device may change from providing status information to valid data on dq7. depending on when the system samples the dq7 output, it may read the status or valid data. even if the device has com- pleted the program or erase operation and dq7 has valid data, the data outputs on dq0?dq6 may be still invalid. valid data on dq7?dq0 will appear on suc- cessive read cycles. table 14 shows the outputs for data# polling on dq7. figure 5 shows the data# polling algorithm. figure 21 in the ac characteristics section shows the data# polling timing diagram. figure 5. data# polling algorithm dq7 = data? yes no no dq5 = 1? no yes yes fail pass read dq7?dq0 addr = va read dq7?dq0 addr = va dq7 = data? start notes: 1. va = valid address for programming. during a sector erase operation, a valid address is any sector address within the sector being erased. during chip erase, a valid address is any non-protected sector address. 2. dq7 should be rechecked even if dq5 = ?1? because dq7 may change simultaneously with dq5.
30 am29dl320g july 31, 2002 advance information ry/by#: ready/busy# the ry/by# is a dedicated, open-drain output pin which indicates whether an embedded algorithm is in progress or complete. the ry/by# status is valid after the rising edge of the final we# pulse in the command sequence. since ry/by# is an open-drain output, sev- eral ry/by# pins can be tied together in parallel with a pull-up resistor to v cc . if the output is low (busy), the device is actively eras- ing or programming. (this includes programming in the erase suspend mode.) if the output is high (ready), the device is in the read mode, the standby mode, or one of the banks is in the erase-sus- pend-read mode. table 14 shows the outputs for ry/by#. dq6: toggle bit i toggle bit i on dq6 indicates whether an embedded program or erase algorithm is in progress or com- plete, or whether the device has entered the erase suspend mode. toggle bit i may be read at any ad- dress, and is valid after the rising edge of the final we# pulse in the command sequence (prior to the program or erase operation), and during the sector erase time-out. during an embedded program or erase algorithm op- eration, successive read cycles to any address cause dq6 to toggle. the system may use either oe# or ce# to control the read cycles. when the operation is complete, dq6 stops toggling. after an erase command sequence is written, if all sectors selected for erasing are protected, dq6 toggles for approxi- mately 100 s, then returns to reading array data. if not all selected sectors are protected, the embedded erase algo- rithm erases the unprotected sectors, and ignores the se- lected sectors that are protected. the system can use dq6 and dq2 together to determine whether a sector is actively erasing or is erase-suspended. when the device is actively erasing (that is, the embedded erase algorithm is in progress), dq6 toggles. when the de- vice enters the erase suspend mode, dq6 stops toggling. however, the system must also use dq2 to determine which sectors are erasing or erase-suspended. alterna- tively, the system can use dq7 (see the subsection on dq7: data# polling). if a program address falls within a protected sector, dq6 toggles for approximately 1 s after the program command sequence is written, then returns to reading array data. dq6 also toggles during the erase-suspend-program mode, and stops toggling once the embedded pro- gram algorithm is complete. table 14 shows the outputs for toggle bit i on dq6. figure 6 shows the toggle bit algorithm. figure 22 in the ?ac characteristics? section shows the toggle bit timing diagrams. figure 23 shows the differences be- tween dq2 and dq6 in graphical form. see also the subsection on dq2: toggle bit ii. figure 6. toggle bit algorithm start no yes yes dq5 = 1? no yes toggle bit = toggle? no program/erase operation not complete, write reset command program/erase operation complete read dq7?dq0 toggle bit = toggle? read dq7?dq0 twice read dq7?dq0 note: the system should recheck the toggle bit even if dq 5 = ?1? because the toggle bit may stop toggling as dq5 changes to ?1.? see the subsections on dq6 and dq2 for more information.
july 31, 2002 am29dl320g 31 advance information dq2: toggle bit ii the ?toggle bit ii? on dq2, when used with dq6, indi- cates whether a particular sector is actively erasing (that is, the embedded erase algorithm is in progress), or whether that sector is erase-suspended. toggle bit ii is valid after the rising edge of the final we# pulse in the command sequence. dq2 toggles when the system reads at addresses within those sectors that have been selected for era- sure. (the system may use either oe# or ce# to con- trol the read cycles.) but dq2 cannot distinguish whether the sector is actively erasing or is erase-sus- pended. dq6, by comparison, indicates whether the device is actively erasing, or is in erase suspend, but cannot distinguish which sectors are selected for era- sure. thus, both status bits are required for sector and mode information. refer to table 14 to compare out- puts for dq2 and dq6. figure 6 shows the toggle bit algorithm in flowchart form, and the section ?dq2: toggle bit ii? explains the algorithm. see also the dq 6: toggle bit i subsection. figure 22 shows the toggle bit timing diagram. figure 23 shows the differences between dq2 and dq6 in graphical form. reading toggle bits dq6/dq2 refer to figure 6 for the following discussion. when- ever the system initially begins reading toggle bit sta- tus, it must read dq7?dq0 at least twice in a row to determine whether a toggle bit is toggling. typically, the system would note and store the value of the tog- gle bit after the first read. after the second read, the system would compare the new value of the toggle bit with the first. if the toggle bit is not toggling, the device has completed the program or erase operation. the system can read array data on dq7?dq0 on the fol- lowing read cycle. however, if after the initial two read cycles, the system determines that the toggle bit is still toggling, the sys- tem also should note whether the value of dq5 is high (see the section on dq5). if it is, the system should then determine again whether the toggle bit is tog- gling, since the toggle bit may have stopped toggling just as dq5 went high. if the toggle bit is no longer toggling, the device has successfully completed the program or erase operation. if it is still toggling, the de- vice did not completed the operation successfully, and the system must write the reset command to return to reading array data. the remaining scenario is that the system initially de- termines that the toggle bit is toggling and dq5 has not gone high. the system may continue to monitor the toggle bit and dq5 through successive read cy- cles, determining the status as described in the previ- ous paragraph. alternatively, it may choose to perform other system tasks. in this case, the system must start at the beginning of the algorithm when it returns to de- termine the status of the operation (top of figure 6 ). dq5: exceeded timing limits dq5 indicates whether the program or erase time has exceeded a specified internal pulse count limit. under these conditions dq5 produces a ?1,? indicating that the program or erase cycle was not successfully completed. the device may output a ?1? on dq5 if the system tries to program a ?1? to a location that was previously pro- grammed to ?0.? only an erase operation can change a ?0? back to a ?1.? under this condition, the device halts the operation, and when the timing limit has been exceeded, dq5 produces a ?1.? under both these conditions, the system must write the reset command to return to the read mode (or to the erase-suspend-read mode if a bank was previ- ously in the erase-suspend-program mode). dq3: sector erase timer after writing a sector erase command sequence, the system may read dq3 to determine whether or not erasure has begun. (the sector erase timer does not apply to the chip erase command.) if additional sectors are selected for erasure, the entire time-out also applies after each additional sector erase com- mand. when the time-out period is complete, dq3 switches from a ?0? to a ?1.? if the time between addi- tional sector erase commands from the system can be assumed to be less than 50 s, the system need not monitor dq3. see also the sector erase command sequence section. after the sector erase command is written, the system should read the status of dq7 (data# polling) or dq6 (toggle bit i) to ensure that the device has accepted the command sequence, and then read dq3. if dq3 is ?1,? the embedded erase algorithm has begun; all fur- ther commands (except erase suspend) are ignored until the erase operation is complete. if dq3 is ?0,? the device will accept additional sector erase commands. to ensure the command has been accepted, the sys- tem software should check the status of dq3 prior to and following each subsequent sector erase com- mand. if dq3 is high on the second status check, the last command might not have been accepted. table 14 shows the status of dq3 relative to the other status bits.
32 am29dl320g july 31, 2002 advance information table 14. write operation status notes: 1. dq5 switches to ?1? when an embedded program or embedded erase operation has exceeded the maximum timing limits. refer to the section on dq5 for more information. 2. dq7 and dq2 require a valid address when reading status information. refer to the appropriate subsection for further details. 3. when reading write operation status bits, the system must always provide the bank address where the embedded algorithm is in progress. the device outputs array data if the system addresses a non-busy bank. status dq7 (note 2) dq6 dq5 (note 1) dq3 dq2 (note 2) ry/by# standard mode embedded program algorithm dq7# toggle 0 n/a no toggle 0 embedded erase algorithm 0 toggle 0 1 toggle 0 erase suspend mode erase-suspend- read erase suspended sector 1 no toggle 0 n/a toggle 1 non-erase suspended sector data data data data data 1 erase-suspend-program dq7# toggle 0 n/a n/a 0
july 31, 2002 am29dl320g 33 advance information absolute maximum ratings storage temperature plastic packages . . . . . . . . . . . . . . . ?65 c to +150 c ambient temperature with power applied . . . . . . . . . . . . . ?65 c to +125 c voltage with respect to ground v cc (note 1) . . . . . . . . . . . . . . . . .?0.5 v to +4.0 v a9 , oe# , and reset# (note 2) . . . . . . . . . . . . . . . . . . . .?0.5 v to +12.5 v wp#/acc . . . . . . . . . . . . . . . . . .?0.5 v to +10.5 v all other pins (note 1) . . . . . . ?0.5 v to v cc +0.5 v output short circuit current (note 3) . . . . . . 200 ma notes: 1. minimum dc voltage on input or i/o pins is ?0.5 v. during voltage transitions, input or i/o pins may overshoot v ss to ?2.0 v for periods of up to 20 ns. maximum dc voltage on input or i/o pins is v cc +0.5 v. see figure 7 . during voltage transitions, input or i/o pins may overshoot to v cc +2.0 v for periods up to 20 ns. see figure 8 . 2. minimum dc input voltage on pins a9, oe#, reset#, and wp#/acc is ?0.5 v. during voltage transitions, a9, oe#, wp#/acc, and reset# may overshoot v ss to ?2.0 v for periods of up to 20 ns. see figure 7 . maximum dc input voltage on pin a9 is +12.5 v which may overshoot to +14.0 v for periods up to 20 ns. maximum dc input voltage on wp#/acc is +9.5 v which may overshoot to +12.0 v for periods up to 20 ns. 3. no more than one output may be shorted to ground at a time. duration of the short circuit should not be greater than one second. stresses above those listed under ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this data sheet is not implied. exposure of the device to absolute maximum rating conditions for extended periods may affect device reliability. figure 7. maximum negative overshoot waveform figure 8. maximum positive overshoot waveform operating ranges industrial (i) devices ambient temperature (t a ) . . . . . . . . . ?40c to +85c extended (e) devices ambient temperature (t a ) . . . . . . . . ?55c to +125c v cc supply voltages v cc for standard voltage range . . . . . . . 2.7 v to 3.6 v operating ranges define those limits between which the functionality of the device is guaranteed. 20 ns 20 ns +0.8 v ?0.5 v 20 ns ?2.0 v 20 ns 20 ns v cc +2.0 v v cc +0.5 v 20 ns 2.0 v
34 am29dl320g july 31, 2002 advance information dc characteristics cmos compatible notes: 1. the i cc current listed is typically less than 2 ma/mhz, with oe# at v ih . 2. maximum i cc specifications are tested with v cc = v cc max. 3. i cc active while embedded erase or embedded program is in progress. 4. automatic sleep mode enables the low power mode when addresses remain stable for t acc + 30 ns. typical sleep mode current is 200 na. 5. not 100% tested. parameter symbol parameter description test conditions min typ max unit i li input load current v in = v ss to v cc , v cc = v cc max 1.0 a i lit a9 input load current v cc = v cc max ; a9 = 12.5 v 35 a i lo output leakage current v out = v ss to v cc , v cc = v cc max 1.0 a i cc1 v cc active read current (notes 1, 2) ce# = v il, oe# = v ih , byte mode 5 mhz 10 16 ma 1 mhz 2 4 ce# = v il, oe# = v ih , word mode 5 mhz 10 16 1 mhz 2 4 i cc2 v cc active write current (notes 2, 3) ce# = v il, oe# = v ih , we# = v il 15 30 ma i cc3 v cc standby current (note 2) ce#, reset# = v cc 0.3 v 0.2 5 a i cc4 v cc reset current (note 2) reset# = v ss 0.3 v 0.2 5 a i cc5 automatic sleep mode (notes 2, 4) v ih = v cc 0.3 v; v il = v ss 0.3 v 0.2 5 a i cc6 v cc active read-while-program current (notes 1, 2) ce# = v il , oe# = v ih byte 21 45 ma word 21 45 i cc7 v cc active read-while-erase current (notes 1, 2) ce# = v il , oe# = v ih byte 21 45 ma word 21 45 i cc8 v cc active program-while-erase-suspended current (notes 2, 5) ce# = v il , oe# = v ih 17 35 ma i acc acc accelerated program current, word or byte ce# = v il , oe# = v ih acc pin 5 10 ma v cc pin 15 30 ma v il input low voltage ?0.5 0.8 v v ih input high voltage 0.7 x v cc v cc + 0.3 v v hh voltage for wp#/acc sector protect/unprotect and program acceleration v cc = 3.0 v 10% 8.5 9.5 v v id voltage for autoselect and temporary sector unprotect v cc = 3.0 v 10% 8.5 12.5 v v ol output low voltage i ol = 4.0 ma, v cc = v cc min 0.45 v v oh1 output high voltage i oh = ?2.0 ma, v cc = v cc min 0.85 v cc v v oh2 i oh = ?100 a, v cc = v cc min v cc ?0.4 v lko low v cc lock-out voltage (note 5) 2.3 2.5 v
july 31, 2002 am29dl320g 35 advance information dc characteristics zero-power flash n ote: addresses are switching at 1 mhz figure 9. i cc1 current vs. time (showing active and automatic sleep currents) 25 20 15 10 5 0 0 500 1000 1500 2000 2500 3000 3500 4000 supply current in ma time in ns 10 8 2 0 1 2345 frequency in mhz supply current in ma n ote: t = 25 c figure 10. typical i cc1 vs. frequency 2.7 v 3.6 v 4 6 12
36 am29dl320g july 31, 2002 advance information test conditions table 15. test specifications key to switching waveforms 2.7 k ? c l 6.2 k ? 3.3 v device under te s t n ote: diodes are in3064 or equivalent figure 11. test setup test condition 70, 90 120 unit output load 1 ttl gate output load capacitance, c l (including jig capacitance) 30 100 pf input rise and fall times 5 ns input pulse levels 0.0?3.0 v input timing measurement reference levels 1.5 v output timing measurement reference levels 1.5 v waveform inputs outputs steady changing from h to l changing from l to h don?t care, any change permitted changing, state unknown does not apply center line is high impedance state (high z) 3.0 v 0.0 v 1.5 v 1.5 v output measurement level input figure 12. input waveforms and measurement levels
july 31, 2002 am29dl320g 37 advance information ac characteristics read-only operations notes: 1. not 100% tested. 2. see figure 11 and table 15 for test specifications. parameter description test setup speed options jedec std. 70 90 120 unit t avav t rc read cycle time (note 1) min 70 90 120 ns t avqv t acc address to output delay ce#, oe# = v il max 70 90 120 ns t elqv t ce chip enable to output delay oe# = v il max 70 90 120 ns t glqv t oe output enable to output delay max 30 40 50 ns t ehqz t df chip enable to output high z (note 1) max 16 ns t ghqz t df output enable to output high z (note 1) max 16 ns t axqx t oh output hold time from addresses, ce# or oe#, whichever occurs first min 0 ns t oeh output enable hold time (note 1) read min 0 ns toggle and data# polling min 10 ns t oh t ce outputs we# addresses ce# oe# high z output valid high z addresses stable t rc t acc t oeh t rh t oe t rh 0 v ry/by# reset# t df figure 13. read operation timings
38 am29dl320g july 31, 2002 advance information ac characteristics hardware reset (reset#) note: not 100% tested. parameter description all speed options unit jedec std t ready reset# pin low (during embedded algorithms) to read mode (see note) max 20 s t ready reset# pin low (not during embedded algorithms) to read mode (see note) max 500 ns t rp reset# pulse width min 500 ns t rh reset high time before read (see note) min 50 ns t rpd reset# low to standby mode min 20 s t rb ry/by# recovery time min 0 ns reset# ry/by# ry/by# t rp t ready reset timings not during embedded algorithms t ready ce#, oe# t rh ce#, oe# reset timings during embedded algorithms reset# t rp t rb figure 14. reset timings
july 31, 2002 am29dl320g 39 advance information ac characteristics word/byte configuration (byte#) parameter speed options jedec std description 70 90 120 unit t elfl /t elfh ce# to byte# switching low or high max 5 ns t flqz byte# switching low to output high z max 16 ns t fhqv byte# switching high to output active min 70 90 120 ns dq15 output data output (dq7?dq0) ce# oe# byte# t elfl dq14?dq0 data output (dq14?dq0) dq15/a-1 address input t flqz byte# switching from word to byte mode dq15 output data output (dq7?dq0) byte# t elfh dq14?dq0 data output (dq14?dq0) dq15/a-1 address input t fhqv byte# switching from byte to word mode figure 15. byte# timings for read operations note: refer to the erase/program operations table for t as and t ah specifications. figure 16. byte# timings for write operations ce# we# byte# the falling edge of the last we# signal t hold (t ah ) t set (t as )
40 am29dl320g july 31, 2002 advance information ac characteristics erase and program operations notes: 1. not 100% tested. 2. see the ?erase and programming performance? section for more information. parameter speed options jedec std description 70 90 120 unit t avav t wc write cycle time (note 1) min 70 90 120 ns t avwl t as address setup time min 0 ns t aso address setup time to oe# low during toggle bit polling min 15 15 ns t wlax t ah address hold time min 45 45 50 ns t aht address hold time from ce# or oe# high during toggle bit polling min 0 ns t dvwh t ds data setup time min 35 45 50 ns t whdx t dh data hold time min 0 ns t oeph output enable high during toggle bit polling min 20 ns t ghwl t ghwl read recovery time before write (oe# high to we# low) min 0 ns t elwl t cs ce# setup time min 0 ns t wheh t ch ce# hold time min 0 ns t wlwh t wp write pulse width min 30 35 50 ns t whdl t wph write pulse width high min 30 ns t sr/w latency between read and write operations min 0 ns t whwh1 t whwh1 programming operation (note 2) byte typ 5 s word typ 7 t whwh1 t whwh1 accelerated programming operation, word or byte (note 2) typ 4 s t whwh2 t whwh2 sector erase operation (note 2) typ 0.4 sec t vcs v cc setup time (note 1) min 50 s t rb write recovery time from ry/by# min 0 ns t busy program/erase valid to ry/by# delay min 90 ns
july 31, 2002 am29dl320g 41 advance information ac characteristics oe# we# ce# v cc data addresses t ds t ah t dh t wp pd t whwh1 t wc t as t wph t vcs 555h pa pa read status data (last two cycles) a0h t cs status d out program command sequence (last two cycles) ry/by# t rb t busy t ch pa n otes: 1 . pa = program address, pd = program data, d out is the true data at the program address. 2 . illustration shows device in word mode. figure 17. program operation timings w p#/acc t vhh v hh v il or v ih v il or v ih t vhh figure 18. accelerated program timing diagram
42 am29dl320g july 31, 2002 advance information ac characteristics oe# ce# addresses v cc we# data 2aah sa t ah t wp t wc t as t wph 555h for chip erase 10 for chip erase 30h t ds t vcs t cs t dh 55h t ch in progress complete t whwh2 va va erase command sequence (last two cycles) read status data ry/by# t rb t busy n otes: 1 . sa = sector address (for sector erase), va = valid address for reading status data (see ?write operation status?. 2 . these waveforms are for the word mode. figure 19. chip/sector erase operation timings
july 31, 2002 am29dl320g 43 advance information ac characteristics oe# ce# we# a ddresses t oh data valid in valid in valid pa valid ra t wc t wph t ah t wp t ds t dh t rc t ce valid out t oe t acc t oeh t ghwl t df valid in ce# controlled write cycles we# controlled write cycle valid pa valid pa t cp t cph t wc t wc read cycle t sr/w figure 20. back-to-back read/write cycle timings we# ce# oe# high z t oe high z dq7 dq0?dq6 ry/by# t busy complement true addresses va t oeh t ce t ch t oh t df va va status data complement status data true valid data valid data t acc t rc n ote: va = valid address. illustration shows first status cycle after command sequence, last status read cycle, and array data r ead cycle. figure 21. data# polling timings (during embedded algorithms)
44 am29dl320g july 31, 2002 advance information ac characteristics oe# ce# we# a ddresses t oeh t dh t aht t aso t oeph t oe valid data (first read) (second read) (stops toggling) t ceph t aht t as dq6/dq2 valid dat a valid status valid status valid status ry/by# n ote: va = valid address; not required for dq6. illustration shows first two status cycle after command sequence, last status r ead cycle, and array data read cycle figure 22. toggle bit timings (during embedded algorithms) n ote: dq2 toggles only when read at an address within an erase-suspended sector. the system may use oe# or ce# to togg le d q2 and dq6. figure 23. dq2 vs. dq6 enter erase erase erase enter erase suspend program erase suspend read erase suspend read erase we# dq6 dq2 erase complete erase suspend suspend program resume embedded erasing
july 31, 2002 am29dl320g 45 advance information ac characteristics temporary sector unprotect note: not 100% tested. parameter all speed options jedec std description unit t vidr v id rise and fall time (see note) min 500 ns t vhh v hh rise and fall time (see note) min 250 ns t rsp reset# setup time for temporary sector unprotect min 4 s t rrb reset# hold time from ry/by# high for temporary sector unprotect min 4 s r eset# t vidr v id v ss , v il , or v ih v id v ss , v il , or v ih ce# we# ry/by# t vidr t rsp program or erase command sequence t rrb figure 24. temporary sector unprotect timing diagram
46 am29dl320g july 31, 2002 advance information ac characteristics sector/sector block protect: 150 s, sector/sector block unprot ect: 15 ms 1 s r eset# sa, a6, a1, a0 data ce# we# oe# 60h 60h 40h valid* valid* valid* status sector/sector block protect or unprotect verify v id v ih * for sector protect, a6 = 0, a1 = 1, a0 = 0. for sector unprotect, a6 = 1, a1 = 1, a0 = 0. figure 25. sector/sector block protect and unprotect timing diagram
july 31, 2002 am29dl320g 47 advance information ac characteristics alternate ce# controlled er ase and program operations notes: 1. not 100% tested. 2. see the ?erase and programming performance? section for more information. parameter speed options jedec std description 70 90 120 unit t avav t wc write cycle time (note 1) min 70 90 120 ns t avwl t as address setup time min 0 ns t elax t ah address hold time min 45 45 50 ns t dveh t ds data setup time min354550ns t ehdx t dh data hold time min 0 ns t ghel t ghel read recovery time before write (oe# high to we# low) min 0 ns t wlel t ws we# setup time min 0 ns t ehwh t wh we# hold time min 0 ns t eleh t cp ce# pulse width min 30 35 50 ns t ehel t cph ce# pulse width high min 30 ns t whwh1 t whwh1 programming operation (note 2) byte typ 5 s word typ 7 t whwh1 t whwh1 accelerated programming operation, word or byte (note 2) typ 4 s t whwh2 t whwh2 sector erase operation (note 2) typ 0.4 sec
48 am29dl320g july 31, 2002 advance information ac characteristics t ghel t ws oe# ce# we# reset# t ds data t ah addresses t dh t cp dq7# d out t wc t as t cph pa data# polling a0 for program 55 for erase t rh t whwh1 or 2 ry/by# t wh pd for program 30 for sector erase 10 for chip erase 555 for program 2aa for erase pa for program sa for sector erase 555 for chip erase t busy n otes: 1 . figure indicates last two bus cycles of a program or erase operation. 2 . pa = program address, sa = sector address, pd = program data. 3 . dq7# is the complement of the data written to the device. d out is the data written to the device. 4 . waveforms are for the word mode. figure 26. alternate ce# controlled write (erase/program) operation timings
july 31, 2002 am29dl320g 49 advance information erase and programming performance notes: 1. typical program and erase times assume the following conditions: 25 c, 3.0 v v cc , 1,000,000 cycles. additionally, programming typicals assume checkerboard pattern. 2. under worst case conditions of 90 c, v cc = 2.7 v (3.0 v for regulated devices), 1,000,000 cycles. 3. the typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes program faster than the maximum program times listed. 4. in the pre-programming step of the embedded erase algorithm, all bytes are programmed to 00h before erasure. 5. system-level overhead is the time required to execute t he two- or four-bus-cycle sequence for the program command. see table 13 for further information on command definitions. 6. the device has a minimum erase and program cycle endurance of 1,000,000 cycles. latchup characteristics note: includes all pins except v cc . test conditions: v cc = 3.0 v, one pin at a time. tsop and so pin capacitance notes: 1. sampled, not 100% tested. 2. test conditions t a = 25c, f = 1.0 mhz. data retention parameter typ (note 1) max (note 2) unit comments sector erase time 0.4 5 sec excludes 00h programming prior to erasure (note 4) chip erase time 28 sec byte program time 5 150 s excludes system level overhead (note 5) accelerated byte/word program time 4 120 s word program time 7 210 s chip program time (note 3) byte mode 21 63 sec word mode 14 42 description min max input voltage with respect to v ss on all pins except i/o pins (including a9, oe#, and reset#) ?1.0 v 12.5 v input voltage with respect to v ss on all i/o pins ?1.0 v v cc + 1.0 v v cc current ?100 ma +100 ma parameter symbol parameter description test setup typ max unit c in input capacitance v in = 0 6 7.5 pf c out output capacitance v out = 0 8.5 12 pf c in2 control pin capacitance v in = 0 7.5 9 pf parameter description test conditions min unit minimum pattern data retention time 150 c10years 125 c20years
50 am29dl320g july 31, 2002 advance information physical dimensions fbd063?63-ball fine-pitch ball grid array (fbga) 8 x 14 mm dwg rev af; 10/99
july 31, 2002 am29dl320g 51 advance information physical dimensions fbd048?fine-pitch ball grid array, 6 x 12 mm dwg rev ag; 7/2000 fbd 048 6.00 mm x 12.00 mm package 1.20 0.20 0.84 0.94 12.00 bsc 6.00 bsc 5.60 bsc 4.00 bsc 8 6 48 0.25 0.30 0.35 0.80 bsc 0.40 bsc
52 am29dl320g july 31, 2002 advance information physical dimensions ts 048?thin small outline package dwg rev aa; 10/99
july 31, 2002 am29dl320g 53 advance information physical dimensions laa064?64-ball fortified ball grid array ( f bga) 11 x 13 mm package
54 am29dl320g july 31, 2002 advance information revision summary revision a (december 6, 2001) initial release. revision a+1 (february 19, 2002) ordering information corrected package marking for 6 x 12 mm fbga package. revision b (july 31, 2002) global added laa064 package. ordering information corrected package marking for fbga. ac characteristics added 70 ns speed grade to test specifications and read-only operations trademarks copyright ? 2002 advanced micro devices, inc. all rights reserved. amd, the amd logo, and combinations thereof are regi stered trademarks of advanced micro devices, inc. expressflash is a trademark of advanced micro devices, inc. product names used in this publication ar e for identification purposes only and may be trademarks of their respective companies .
july 31, 2002 am29dl320g 55 advance information

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